Abstract:
A light emitting diode package module includes a printed circuit board, a wiring film and light emitting diode packages. The printed circuit board includes first regions and second regions, which are alternately disposed. The wiring film is disposed over the printed circuit board and includes first sections and second sections, which are alternately disposed. Each diode package is disposed between one of the first regions and one of the first sections. The light emitting diode package is electrically connected to the wiring film. The second sections and the second regions are adhered to each other so that the wiring film and the printed circuit board are electrically connected.
Abstract:
A receiving module of a liquid crystal display panel includes a mold frame and a bottom chassis. The mold frame forms an internal space that receives a backlight unit. The bottom chassis includes a bottom portion facing a rear side of the mold frame and includes side walls connected with the bottom portion and facing an outer side of the mold frame. At least one of the side walls includes a fastening protrusion in at least one side thereof, and the mold frame includes a groove portion that receives, at an outer side thereof, the at least one side wall including the fastening protrusion such that the mold frame is coupled to an inner side of the side wall and the fastening protrusion.
Abstract:
A receiving module of a liquid crystal display panel includes a mold frame and a bottom chassis. The mold frame forms an internal space that receives a backlight unit. The bottom chassis includes a bottom portion facing a rear side of the mold frame and includes side walls connected with the bottom portion and facing an outer side of the mold frame. At least one of the side walls includes a fastening protrusion in at least one side thereof, and the mold frame includes a groove portion that receives, at an outer side thereof, the at least one side wall including the fastening protrusion such that the mold frame is coupled to an inner side of the side wall and the fastening protrusion.
Abstract:
A light emitting diode package module includes a printed circuit board, a wiring film and light emitting diode packages. The printed circuit board includes first regions and second regions, which are alternately disposed. The wiring film is disposed over the printed circuit board and includes first sections and second sections, which are alternately disposed. Each diode package is disposed between one of the first regions and one of the first sections. The light emitting diode package is electrically connected to the wiring film. The second sections and the second regions are adhered to each other so that the wiring film and the printed circuit board are electrically connected.
Abstract:
A method of and system for cleaning semiconductor wafers minimizes the exposure of the wafers to the air by washing, rinsing and drying the wafers in one cleaning chamber. The system includes a wafer support by which a plurality of wafers can be supported in the cleaning chamber as oriented vertically and spaced from each other, and tubular de-ionized water supply nozzles extending longitudinally in the direction in which the wafers are spaced from each other as disposed to the sides of the wafers. Each de-ionized water supply nozzle has an inner nozzle passageway, and a plurality of sets of nozzle holes extending radially through the main body of the nozzle from the inner nozzle passageway. Each such set of nozzle holes subtends an angle of 80˜100° in a vertical plane and is directed towards a surface of a respective wafer W. During a primary rinse procedure, the de-ionized water is supplied to the de-ionized water spray nozzles, and the liquid in the cleaning chamber is simultaneously discharged from a lower part of the chamber and by being allowed to overflow the chamber. The supplying of the de-ionized water to the de-ionized water spray nozzles and the discharging of the cleaning chamber are carried out in proportions that minimize differences in the etching rate of a wafer across the surface thereof.
Abstract:
A Fast Fourier Transform (FFT) apparatus for selectively performing Fast Hadamard transform (FHT), and a complementary code keying (CCK) modulation/demodulation apparatus using the same. An OFDM module and CCK module are integrated as one module having lower complexity compared to conventional scheme by embodying the CCK modulation using FFT structure in the OFDM module, and embodying the suboptimal and the optimized CCK modulations using FFT structure in OFDM module. CDMA, OFDM, CCK modules may be integrated as single module.
Abstract:
The present invention relates to high selective herbicidal phenoxypropionic acid alkoxycarbonyl anilid compounds represented in formula 1, method of preparing thereof, their use to control barnyard grass produced from rice, and a composition as suitable herbicides, wherein R is a hydrogen atom, methyl or ethyl group; R1 is a hydrogen atom, C1-C6 alkyl, C1-C6 alkyl substituted with 1 to 3 of the group consisting of hydroxy, carboxyl, and a halogen atom, C3-C6 cycloalkyl, C3-C4 alkenyl, C3-C4 alkinyl, or C2-C4 alkoxyalkyl group; n is an integer of 1 or 2 and when n is 2, R1 can be a combination of other substituents.
Abstract:
A liquid crystal display is disclosed. In one embodiment, the display includes i) a liquid crystal display panel configured to display images, ii) a backlight unit configured to provide light to the liquid crystal display panel and iii) a mold frame comprising a frame main body and a plurality of first side walls, wherein the frame main body is configured to receive the backlight unit, and wherein the first side walls are formed on a top surface of the frame main body. The display may further include a bottom chassis comprising a bottom plate and a plurality of second side walls, wherein the bottom plate is configured to support the mold frame and wherein the second side walls are formed at edges of the bottom plate. The first and second side walls surround side surfaces of the liquid crystal display panel while not contacting the side surfaces, and the first and second side walls are alternately disposed along a circumferential direction of the liquid crystal display panel.
Abstract:
A Fast Fourier Transform (FFT) apparatus for selectively performing Fast Hadamard transform (FHT), and a complementary code keying (CCK) modulation/demodulation apparatus using the same are disclosed. In the present invention, OFDM module and CCK module are integrated as one module having lower complexity compared to conventional scheme by embodying the CCK modulation using FFT structure in the OFDM module, and embodying the suboptimal and the optimized CCK modulations using FFT structure in OFDM module. Furthermore, according to the present invention, CDMA, OFDM, CCK modules may be integrated as single module.
Abstract:
A valve having a magnetic force transmission apparatus is disclosed including: a closed body for tightly closing internal components and rotation shaft of the body of the valve, so as to interrupt the leakage of fluid from the valve and maintain perfect airtightness; and a pair of permanent magnet plates opposingly placed in the closed body and for allowing the valve open/close by transmitting power using the magnetic force of magnet pieces attached on yokes in non-contact.