发明申请
- 专利标题： Flexible, Molded or Extruded Articles and Semiconductive Compounds for Their Manufacture
- 专利标题（中）： 柔性，成型或挤压制品及其制造的半导体化合物
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申请号： US13496532申请日： 2010-09-08
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公开(公告)号： US20120171496A1公开(公告)日： 2012-07-05
- 发明人: Mohamed Esseghir , Jeffrey M. Cogen
- 申请人： Mohamed Esseghir , Jeffrey M. Cogen
- 国际申请： PCT/US10/48075 WO 20100908
- 主分类号： B32B27/40
- IPC分类号： B32B27/40 ; H01B1/24 ; B32B9/04 ; B32B27/00 ; B32B15/08
摘要：
A molded or extruded article, e.g., an electrical part or shielded cable, comprises at least one insulation layer and at least one semiconductive layer, the semiconductive layer thick and comprising in weight percent: A. 1 to 30 wt % of conductive filler; B. 10 to 90 wt % of a non-olefin elastomer; C. 10 to 90 wt % of an olefin elastomer; and D. Optionally, 0.5 to 2.5 wt % of peroxide. Carbon black and/or metal particulates or powder typically comprise the filler, silicone or urethane rubber the non-olefin elastomer, and EPR or EPDM the olefin elastomer.