Invention Application
- Patent Title: SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13235372Application Date: 2011-09-17
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Publication No.: US20120171814A1Publication Date: 2012-07-05
- Inventor: Eun-Kyoung CHOI , SeYoung JEONG , Kwang-chul CHOI , Tae Hong MIN , Chungsun LEE , Jung-Hwan KIM
- Applicant: Eun-Kyoung CHOI , SeYoung JEONG , Kwang-chul CHOI , Tae Hong MIN , Chungsun LEE , Jung-Hwan KIM
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2010-0139991 20101231
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/56 ; H01L21/78
Abstract:
Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer.
Public/Granted literature
- US08759147B2 Semiconductor packages and methods of fabricating the same Public/Granted day:2014-06-24
Information query
IPC分类:
