发明申请
- 专利标题： WAFER PROCESSING WITH CARRIER EXTENSION
- 专利标题（中）： 带载波延伸的波浪加工
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申请号： US13333152申请日： 2011-12-21
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公开(公告)号： US20120171870A1公开(公告)日： 2012-07-05
- 发明人: Bojan Mitrovic , Guanghua Wei , Eric A. Armour , Ajit Paranjpe
- 申请人： Bojan Mitrovic , Guanghua Wei , Eric A. Armour , Ajit Paranjpe
- 申请人地址： US NY Plainview
- 专利权人： VEECO INSTRUMENTS INC.
- 当前专利权人： VEECO INSTRUMENTS INC.
- 当前专利权人地址： US NY Plainview
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; B05C13/00 ; H01L21/302 ; C23C16/46 ; C23C16/458 ; H01L21/683 ; B44C1/22 ; C23C16/455
摘要：
Apparatus for treating wafers using a wafer carrier rotated about an axis is provided with a ring which surrounds the wafer carrier during operation. Treatment gasses directed onto a top surface of the carrier flow outwardly away from the axis over the carrier and over the ring, and pass downstream outside of the ring. The outwardly flowing gasses form a boundary over the carrier and ring. The ring helps to maintain a boundary layer of substantially uniform thickness over the carrier, which promotes uniform treatment of the wafers.
公开/授权文献
- US10167554B2 Wafer processing with carrier extension 公开/授权日：2019-01-01
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