Invention Application
- Patent Title: Semiconductor Device and Method of Manufacture Thereof
- Patent Title (中): 半导体器件及其制造方法
-
Application No.: US13008591Application Date: 2011-01-18
-
Publication No.: US20120181874A1Publication Date: 2012-07-19
- Inventor: Stefan Willkofer , Uwe Wahl , Bernhard Knott , Markus Hammer , Andreas Strasser
- Applicant: Stefan Willkofer , Uwe Wahl , Bernhard Knott , Markus Hammer , Andreas Strasser
- Main IPC: H01F38/14
- IPC: H01F38/14 ; H01L21/50 ; H01L23/52
Abstract:
A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.
Public/Granted literature
- US08614616B2 Semiconductor device and method of manufacture thereof Public/Granted day:2013-12-24
Information query
