发明申请
- 专利标题: METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
- 专利标题(中): 制造半导体器件的方法
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申请号: US13428900申请日: 2012-03-23
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公开(公告)号: US20120184079A1公开(公告)日: 2012-07-19
- 发明人: Jin-Bum Kim , Kwan-Heum Lee , Seung-Hun Lee , Byeong-Chan Lee , Sun-Ghil Lee
- 申请人: Jin-Bum Kim , Kwan-Heum Lee , Seung-Hun Lee , Byeong-Chan Lee , Sun-Ghil Lee
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR2008-64069 20080702
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A semiconductor device can include a first gate electrode including a gate insulating pattern, a gate conductive pattern and a capping pattern that are sequentially stacked on a semiconductor substrate, and a first spacer of a low dielectric constant disposed on a lower sidewall of the first gate electrode. A second spacer of a high dielectric constant, that is greater than the low dielectric constant, is disposed on an upper sidewall of the first gate electrode above the first spacer.
公开/授权文献
- US08716093B2 Methods of manufacturing a semiconductor device 公开/授权日:2014-05-06
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