发明申请
- 专利标题： Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components
- 专利标题（中）： 用于建立微结构元件之间的间隔导电连接的触点布置
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申请号： US13120994申请日： 2009-09-15
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公开(公告)号： US20120187509A1公开(公告)日： 2012-07-26
- 发明人: Knut Gottfried , Maik Wiemer , Axel Franke , Achim Trautmann , Ando Feyh , Sonja Knies , Joerg Froemel
- 申请人： Knut Gottfried , Maik Wiemer , Axel Franke , Achim Trautmann , Ando Feyh , Sonja Knies , Joerg Froemel
- 申请人地址： DE Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DE Stuttgart
- 优先权： DE102008042382.3 20080926
- 国际申请： PCT/EP2009/061921 WO 20090915
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L21/768 ; H01L23/48
摘要：
A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer includes an electrical connection contact, a passivation layer on the electrical connection contact, and a dielectric spacer layer arranged on the passivation layer, wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer, wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection, wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches.