发明申请
US20120187553A1 METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE
审中-公开
制造半导体波形粘结产品的方法，半导体波形粘结产品和半导体器件
- 专利标题： METHOD OF MANUFACTURING SEMICONDUCTOR WAFER BONDING PRODUCT, SEMICONDUCTOR WAFER BONDING PRODUCT AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 制造半导体波形粘结产品的方法，半导体波形粘结产品和半导体器件
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申请号： US13394993申请日： 2010-09-08
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公开(公告)号： US20120187553A1公开(公告)日： 2012-07-26
- 发明人: Masahiro Yoneyama , Masakazu Kawata , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi , Toshihiro Sato
- 申请人： Masahiro Yoneyama , Masakazu Kawata , Toyosei Takahashi , Hirohisa Dejima , Fumihiro Shiraishi , Toshihiro Sato
- 申请人地址： JP Tokyo
- 专利权人： SUMITOMO BAKELITE COMPANY LIMITED
- 当前专利权人： SUMITOMO BAKELITE COMPANY LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-208705 20090909; JP2009-215055 20090916
- 国际申请： PCT/JP2010/065431 WO 20100908
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L21/50
摘要：
A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting the spacer formation layer to exposure and development to be patterned and removing the support base; and a step of bonding a transparent substrate to a region of the spacer where the removed support base was provided so that transparent substrate is included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.
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