公开(公告)号：US20120196075A1

公开(公告)日：2012-08-02

申请号：US13502002

申请日：2010-10-14

申请人： Toyosei Takahashi ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Toyosei Takahashi ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： B32B3/02 ,  C09J163/00

CPC分类号： H01L23/3114 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/15311 ,  Y10T428/21 ,  H01L2924/00

摘要： A resin composition of the present invention is used for providing a spacer 104 having a grid-like shape at a planar view thereof between a semiconductor wafer 101′ and a transparent substrate 102. The resin composition includes a constituent material containing an alkali soluble resin, a thermosetting resin and a photo initiator. In the case where a semiconductor wafer 101′ and a transparent substrate 102 are bonded together through a spacer 104 formed on a substantially overall surface thereof to obtain a bonded body 2000, and then the semiconductor wafer makes one-fifth thickness, a warpage of the bonded body 2000 is 3,000 μm or less. Further, it is preferred that the warpage of the bonded body 2000 before the process thereof is 500 μm or less, and an increasing ratio of the warpage of the bonded body 2000 after the process thereof is 600% or less.

摘要翻译： 本发明的树脂组合物用于在半导体晶片101'和透明基板102之间的平面视图中提供具有格子状的间隔物104.树脂组合物包括含有碱溶性树脂的构成材料， 热固性树脂和光引发剂。 在半导体晶片101'和透明基板102通过形成在其基本上整个表面上的间隔件104结合在一起以获得粘合体2000的情况下，然后半导体晶片形成五分之一厚度， 粘结体2000为3000μm以下。 此外，优选在其加工前的粘合体2000的翘曲为500μm以下，并且其加工后的粘合体2000的翘曲比例增加为600％以下。

公开(公告)号：US20120168970A1

公开(公告)日：2012-07-05

申请号：US13496354

申请日：2010-09-13

申请人： Toshihiro Sato ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi

发明人： Toshihiro Sato ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi

IPC分类号： H01L23/544 ,  H01L23/12 ,  B32B7/02 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L24/13 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/83 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/2495 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05432 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting exposure and development to the spacer formation layer to be patterned and removing the support base; a step of bonding a transparent substrate to a region of the spacer, with which the removed support base made contact, so as to be included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.

摘要翻译： 根据本发明的制造半导体晶片接合产品的方法包括：制备包括具有片状形状的支撑基底和设置在支撑基底上并具有光敏性的间隔物形成层的间隔物形成膜的步骤; 将间隔物形成层从一个表面的一侧附着到具有一个表面的半导体晶片的步骤; 通过对间隔物形成层进行曝光和显影以形成图案化并去除支撑基底来形成间隔物的步骤; 将透明基板粘合到被移除的支撑基底与之接触的间隔件的区域中以便包括在该区域内的步骤。 这使得可以制造半导体晶片接合产品，其中半导体晶片和透明基板通过间隔件均匀可靠地结合在一起。

公开(公告)号：US20120012989A1

公开(公告)日：2012-01-19

申请号：US13202659

申请日：2010-02-15

申请人： Toshihiro Sato ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi

发明人： Toshihiro Sato ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi

IPC分类号： H01L29/02 ,  H01L21/762

CPC分类号： H01L27/14683 ,  H01L23/3114 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention, including: a step of preparing a spacer formation film including a support base and a spacer formation layer; a step of attaching the spacer formation layer of the spacer formation film to a semiconductor wafer; a step of selectively exposing the spacer formation layer with an exposure light via a mask, which is placed at a side of the support base of the spacer formation film, so as to be passed through the support base; a step of removing the support base; a step of developing the spacer formation layer to form a spacer on the semiconductor wafer; and a step of bonding a transparent substrate to a surface of the spacer opposite to the semiconductor wafer.

摘要翻译： 一种制造根据本发明的半导体晶片接合产品的方法，包括：制备包括支撑基体和间隔物形成层的间隔物形成膜的步骤; 将间隔物形成膜的间隔物形成层附着到半导体晶片的步骤; 通过放置在间隔物形成膜的支撑基底的一侧的掩模，用曝光光选择性地曝光间隔物形成层以使其穿过支撑基底的步骤; 去除支撑基底的步骤; 显影间隔物形成层以在半导体晶片上形成间隔物的步骤; 以及将透明基板接合到与半导体晶片相反的间隔物的表面的步骤。

公开(公告)号：US20110316127A1

公开(公告)日：2011-12-29

申请号：US13255633

申请日：2010-02-19

申请人： Fumihiro Shiraishi ,  Mazakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Toshihiro Sato

发明人： Fumihiro Shiraishi ,  Mazakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Toshihiro Sato

IPC分类号： H01L29/06 ,  B32B3/00

CPC分类号： H01L27/14618 ,  C09J7/20 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2924/0002 ,  Y10T428/24752 ,  H01L2924/00

摘要： A spacer formation film is adapted to be used for forming a spacer defining air-gap portions on a side of one surface of a semiconductor wafer and by being cut into a desired shape, the spacer formation film includes: a support base having a sheet-like shape; a spacer formation layer provided on the support base and having a bonding property, the spacer formation layer formed of a material containing an alkali soluble resin, a thermosetting resin and a photo polymerization initiator; and a cutting line along which the spacer formation film is to be cut, wherein the spacer formation layer is provided inside the cutting line so that a peripheral edge thereof is not overlapped to the cutting line.

摘要翻译： 间隔物形成膜适于用于形成在半导体晶片的一个表面的侧面上形成气隙部分并通过切割成所需形状的间隔物，所述间隔物形成膜包括：支撑基底， 像形状; 间隔物形成层，其设置在所述支撑基体上并具有接合特性，所述间隔物形成层由含有碱溶性树脂，热固性树脂和光聚合引发剂的材料形成; 以及要切割间隔物形成膜的切割线，其中间隔物形成层设置在切割线内部，使得其周缘不与切割线重叠。

公开(公告)号：US20120187553A1

公开(公告)日：2012-07-26

申请号：US13394993

申请日：2010-09-08

申请人： Masahiro Yoneyama ,  Masakazu Kawata ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Masahiro Yoneyama ,  Masakazu Kawata ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： H01L23/04 ,  H01L21/50

CPC分类号： H01L23/16 ,  H01L23/3114 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting the spacer formation layer to exposure and development to be patterned and removing the support base; and a step of bonding a transparent substrate to a region of the spacer where the removed support base was provided so that transparent substrate is included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.

摘要翻译： 根据本发明的制造半导体晶片接合产品的方法包括：制备包括具有片状形状的支撑基底和设置在支撑基底上并具有光敏性的间隔物形成层的间隔物形成膜的步骤; 将间隔物形成层从一个表面的一侧附着到具有一个表面的半导体晶片的步骤; 通过对间隔物形成层进行曝光和显影以图案化并去除支撑基底来形成间隔物的步骤; 以及将透明基板粘合到设置有去除的支撑基底的间隔件的区域，使得在该区域内包含透明基板的步骤。 这使得可以制造半导体晶片接合产品，其中半导体晶片和透明基板通过间隔件均匀可靠地结合在一起。

公开(公告)号：US20120032284A1

公开(公告)日：2012-02-09

申请号：US13262127

申请日：2010-03-25

申请人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： H01L29/84 ,  C09J167/06 ,  H01L21/00 ,  H01L31/0203 ,  H01L31/18 ,  C09J161/10 ,  C09J177/00

CPC分类号： C09J163/10 ,  C08L79/08 ,  H01L31/0203

摘要： According to one aspect of the present invention, a film for a resin spacer (10) comprises an adhesive layer (12) made of a resin composition and a cover film (14) covering a surface of the adhesive layer (12). In the above-described film for a resin spacer (10), an adhesion force C1 between the adhesive layer (12) and the cover film (14) and an adhesion force D between the adhesive layer (12) and a silicone resin are set so as to satisfy the condition C1>D. Consequently, it is possible to reduce resin adherence to a cutting table at the time of cutting the film for a resin spacer (10).

摘要翻译： 根据本发明的一个方面，用于树脂间隔物（10）的膜包括由树脂组合物制成的粘合剂层（12）和覆盖粘合剂层（12）的表面的覆盖膜（14）。 在上述用于树脂间隔件（10）的膜中，设置粘合剂层（12）和覆盖膜（14）之间的粘附力C1和粘合剂层（12）和硅树脂之间的粘附力D 以满足条件C1> D。 因此，在切割用于树脂间隔物（10）的膜时，可以减少对切割台的树脂粘附性。

公开(公告)号：US07999354B2

公开(公告)日：2011-08-16

申请号：US12664003

申请日：2008-06-11

申请人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

发明人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

IPC分类号： H01L29/40

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014

摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

摘要翻译： 本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。 树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。 本发明的填充材料由上述树脂组合物的固化物形成。 本发明的绝缘层由上述树脂组合物的固化物形成。 绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。 本发明的半导体器件包括上述绝缘层。

公开(公告)号：US20110316116A1

公开(公告)日：2011-12-29

申请号：US13254658

申请日：2010-04-08

申请人： Toshihiro Sato ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi

发明人： Toshihiro Sato ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi

IPC分类号： H01L29/06 ,  G03F7/028

CPC分类号： H01L31/0203 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0388 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An object of the present invention is to provide a photosensitive resin composition which leaves a small amount of resin residues after patterning by light-exposure and development and can reduce condensation between the semiconductor wafer and the transparent substrate under a high temperature and high humidity environment, an adhesive film made of the photosensitive resin composition and a light-receiving device including the adhesive film. The photosensitive resin composition of the present invention contains an alkali soluble resin (A), a photopolymerization initiator (B) and a compound (C) having a phenolic hydroxyl group and a carboxyl group.

摘要翻译： 本发明的目的是提供一种通过曝光和显影在图案化之后留下少量树脂残留物的感光性树脂组合物，并且可以在高温高湿环境下减少半导体晶片和透明基板之间的冷凝， 由感光性树脂组合物制成的粘合膜和包含粘合膜的光接收装置。 本发明的感光性树脂组合物含有碱溶性树脂（A），光聚合引发剂（B）和具有酚羟基和羧基的化合物（C）。

公开(公告)号：US20110304034A1

公开(公告)日：2011-12-15

申请号：US13202674

申请日：2010-02-15

申请人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： H01L23/04 ,  H01L21/50

CPC分类号： H01L23/315 ,  H01L23/293 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor wafer bonding product according to the present invention includes: a semiconductor wafer; a transparent substrate provided at a side of a functional surface of the semiconductor wafer; a spacer provided between the semiconductor wafer and the transparent substrate; and a bonded portion continuously provided along a periphery of the semiconductor wafer, the transparent substrate being bonded to the semiconductor wafer through the bonded portion. It is preferred that a minimum width of the bonded portion is 50 μm or more.

摘要翻译： 根据本发明的半导体晶片接合产品包括：半导体晶片; 设置在所述半导体晶片的功能面的一侧的透明基板; 设置在所述半导体晶片和所述透明基板之间的间隔物; 以及沿着半导体晶片的周边连续设置的接合部分，透明基板通过接合部分接合到半导体晶片。 接合部的最小宽度优选为50μm以上。

公开(公告)号：US20100181684A1

公开(公告)日：2010-07-22

申请号：US12664003

申请日：2008-06-11

申请人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

发明人： Toyosei Takahashi ,  Rie Takayama ,  Hirohisa Dejima ,  Junya Kusunoki

IPC分类号： H01L23/48 ,  C08L1/00 ,  C08L75/00 ,  C08L67/00 ,  B32B3/10

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014

摘要： A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

摘要翻译： 本发明的树脂组合物用于形成填充半导体衬底的至少通孔的填充材料，所述通孔在其厚度方向上延伸穿过半导体衬底并且在其中具有导电部分。 树脂组合物由具有自由基聚合性双键的树脂，热固性树脂和树脂组成，该树脂与具有自由基聚合双键的具有碱溶性基团和双键的树脂不同; 或环状烯烃树脂。 本发明的填充材料由上述树脂组合物的固化物形成。 本发明的绝缘层由上述树脂组合物的固化物形成。 绝缘层包括：设置在与半导体衬底的功能表面相对的表面上的层状绝缘部分; 以及与所述绝缘部一体形成并填充所述通孔的填充部。 本发明的半导体器件包括上述绝缘层。