发明申请
US20120190187A1 PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHANCEMENT
有权
使用自对准的衬垫进行粘合增强的PAD结合
- 专利标题： PAD BONDING EMPLOYING A SELF-ALIGNED PLATED LINER FOR ADHESION ENHANCEMENT
- 专利标题（中）： 使用自对准的衬垫进行粘合增强的PAD结合
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申请号： US13431254申请日： 2012-03-27
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公开(公告)号： US20120190187A1公开(公告)日： 2012-07-26
- 发明人: Chih-Chao Yang , David V. Horak , Takeshi Nogami , Shom Ponoth
- 申请人： Chih-Chao Yang , David V. Horak , Takeshi Nogami , Shom Ponoth
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
Two substrates are brought together and placed in a plating bath. In one embodiment, a conductive material is plated in microscopic cavities present at the interface between a first metal pad and a second metal pad to form at least one interfacial plated metal liner portion that adheres to a surface of the first metal pad and a surface of the second metal pad. In another embodiment, at least one metal pad is recessed relative to a dielectric surface before being brought together. The two substrates are placed in a plating bath and a conductive material is plated in the cavity between the first metal pad and the second metal pad to form a contiguous plated metal liner layer that adheres to a surface of the first metal pad and a surface of the second metal pad.
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