发明申请
- 专利标题: Through-Hole-Vias In Multi-Layer Printed Circuit Boards
- 专利标题(中): 多层印刷电路板中的通孔
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申请号: US13446727申请日: 2012-04-13
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公开(公告)号: US20120193135A1公开(公告)日: 2012-08-02
- 发明人: Moises Cases , Tae Hong Kim , Rohan U. Mandrekar , Nusrat I. Sherali
- 申请人: Moises Cases , Tae Hong Kim , Rohan U. Mandrekar , Nusrat I. Sherali
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H05K1/11
- IPC分类号: H05K1/11
摘要:
Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.
公开/授权文献
- US08766107B2 Through-hole-vias in multi-layer printed circuit boards 公开/授权日:2014-07-01