发明申请
- 专利标题: METHOD FOR OPERATING SUBSTRATE PROCESSING APPARATUS
- 专利标题(中): 操作基板加工设备的方法
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申请号: US13414953申请日: 2012-03-08
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公开(公告)号: US20120193323A1公开(公告)日: 2012-08-02
- 发明人: Yutaka KOKAZE , Masahisa Ueda , Yoshiaki Yoshida
- 申请人: Yutaka KOKAZE , Masahisa Ueda , Yoshiaki Yoshida
- 申请人地址: JP Chigasaki-shi
- 专利权人: ULVAC, INC.
- 当前专利权人: ULVAC, INC.
- 当前专利权人地址: JP Chigasaki-shi
- 优先权: JP2009-208393 20090909
- 主分类号: H01B13/00
- IPC分类号: H01B13/00 ; B05C9/00 ; B44C1/22
摘要:
A method for operating a substrate processing apparatus is provided which can contain generation of particles by generating plasma in a stable manner. After a substrate is disposed in an evacuated vacuum chamber, a rare gas is initially supplied into the vacuum chamber, a voltage is applied to a plasma generating means, and plasma of the rare gas is generated. Subsequently, a reaction gas is supplied into the vacuum chamber, the reaction gas is brought into contact with the plasma of the rare gas, and plasma of the reaction gas is generated. The plasma of the reaction gas is brought into contact with the substrate; and the substrate is processed. Plasma is stably generated not by turning the reaction gas into plasma but by first turning the rare gas into plasma by the plasma generating means, and generation of particles is subsequently suppressed.
公开/授权文献
- US09305752B2 Method for operating substrate processing apparatus 公开/授权日:2016-04-05
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