Invention Application
- Patent Title: Structure of Mixed Semiconductor Encapsulation Structure with Multiple Chips and Capacitors
- Patent Title (中): 具有多芯片和电容器的混合半导体封装结构的结构
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Application No.: US13442757Application Date: 2012-04-09
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Publication No.: US20120193695A1Publication Date: 2012-08-02
- Inventor: Yan Xun Xue , Anup Bhalla , Jun Lu
- Applicant: Yan Xun Xue , Anup Bhalla , Jun Lu
- Main IPC: H01L27/06
- IPC: H01L27/06
Abstract:
A semiconductor package for power converter application comprises a low-side MOSFET chip and a high-side MOSFET chip stacking one over the other. The semiconductor package may further enclose a capacitor whereas the capacitor may be a discrete component or an integrated component on chip level with the low-side MOSFET. The semiconductor package may further comprise a PIC chip to provide a complete power converter on semiconductor chip assembly package level.
Public/Granted literature
- US08933550B2 Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors Public/Granted day:2015-01-13
Information query
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