发明申请
- 专利标题： STACKED DIE PACKAGES WITH FLIP-CHIP AND WIRE BONDING DIES
- 专利标题（中）： 堆叠的包装与卷芯和线焊接
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申请号： US13016661申请日： 2011-01-28
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公开(公告)号： US20120193772A1公开(公告)日： 2012-08-02
- 发明人: Hunt Hang Jiang
- 申请人： Hunt Hang Jiang
- 主分类号： H01L25/07
- IPC分类号： H01L25/07
摘要：
The present technology discloses a stacked die package. In one embodiment, a package comprises a first die, a second die, and a leadframe. The first die is electrically coupled to the bottom surface of the leadframe through contact bump/bumps. The second die is electrically coupled to the top surface of the leadframe through wirebond/wires. The second die is mounted on the top surface of the first die.
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