发明申请
US20120198396A1 METHOD OF OPTIMIZING SEMICONDUCTOR DEVICE MANUFACTURING PROCESS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER READABLE MEDIUM
审中-公开
优化半导体器件制造工艺的方法，制造半导体器件的方法和非电子计算机可读介质
- 专利标题： METHOD OF OPTIMIZING SEMICONDUCTOR DEVICE MANUFACTURING PROCESS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND NON-TRANSITORY COMPUTER READABLE MEDIUM
- 专利标题（中）： 优化半导体器件制造工艺的方法，制造半导体器件的方法和非电子计算机可读介质
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申请号： US13237854申请日： 2011-09-20
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公开(公告)号： US20120198396A1公开(公告)日： 2012-08-02
- 发明人: Masanari KAJIWARA , Sachiko Kobayashi , Satoshi Tanaka , Kazuhiro Takahata , Shigeki Nojima , Toshiya Kotani , Shimon Maeda
- 申请人： Masanari KAJIWARA , Sachiko Kobayashi , Satoshi Tanaka , Kazuhiro Takahata , Shigeki Nojima , Toshiya Kotani , Shimon Maeda
- 优先权： JP2011-017956 20110131
- 主分类号： G06F17/50
- IPC分类号： G06F17/50
摘要：
A method of optimizing a semiconductor device manufacturing process according to an embodiment is a method of optimizing a semiconductor device manufacturing process in which a pattern based on circuit design is formed. The method of optimizing a semiconductor device manufacturing process according to the embodiment includes: at the time of calculation of a statistic amount based on a distribution of differences at a plurality of sites between a pattern formed by a first exposing apparatus in a first condition and a pattern formed by a second exposing apparatus in a second condition, calculating the statistic amount after applying weighting to the differences based on information on an electrical characteristic; and repeating the calculating with the second condition being changed, and selecting an condition in which the total sum becomes a minimum or equal to or less than a standard value as an optimized condition of the second exposing apparatus.
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