发明申请
US20120199383A1 SUBSTRATE FOR PRINTED WIRING AND RESIN COMPOSITION USED THEREFOR
有权
用于印刷的基材和用于其的树脂组合物
- 专利标题： SUBSTRATE FOR PRINTED WIRING AND RESIN COMPOSITION USED THEREFOR
- 专利标题（中）： 用于印刷的基材和用于其的树脂组合物
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申请号： US13503023申请日： 2010-10-20
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公开(公告)号： US20120199383A1公开(公告)日： 2012-08-09
- 发明人: Motoki Okaniwa , Toshimitsu Kikuchi , Takaaki Uno , Takashi Okada
- 申请人： Motoki Okaniwa , Toshimitsu Kikuchi , Takaaki Uno , Takashi Okada
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-241902 20091020; JP2010-149830 20100630
- 国际申请： PCT/JP2010/068433 WO 20101020
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; C08G65/38
摘要：
There are provided a substrate for printed wiring excellent in light transmission property, heat resistance, mechanical strength and resistance to thermal coloration; a printed wiring laminate; and a resin composition used to produce the substrate and the laminate. The substrate for printed wiring comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate: 20° C./minute), of from 230° C. to 350° C.
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