发明申请
- 专利标题: METHODS FOR ELECTROPLATING COPPER
- 专利标题(中): 电镀铜方法
-
申请号: US13452139申请日: 2012-04-20
-
公开(公告)号: US20120199491A1公开(公告)日: 2012-08-09
- 发明人: Valery M. Dubin , Xingling Xu , Yingxiang Tao , James D. Blanchard
- 申请人: Valery M. Dubin , Xingling Xu , Yingxiang Tao , James D. Blanchard
- 申请人地址: US WA Moses Lake
- 专利权人: MOSES LAKE INDUSTRIES
- 当前专利权人: MOSES LAKE INDUSTRIES
- 当前专利权人地址: US WA Moses Lake
- 主分类号: C25D3/38
- IPC分类号: C25D3/38
摘要:
Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.
公开/授权文献
- US08911609B2 Methods for electroplating copper 公开/授权日:2014-12-16