公开(公告)号：US20120199491A1

公开(公告)日：2012-08-09

申请号：US13452139

申请日：2012-04-20

Applicant: Valery M. Dubin ,  Xingling Xu ,  Yingxiang Tao ,  James D. Blanchard

Inventor： Valery M. Dubin ,  Xingling Xu ,  Yingxiang Tao ,  James D. Blanchard

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C25D5/00 ,  C25D5/02 ,  C25D5/18 ,  C25D17/001 ,  C25D17/10 ,  C25D17/12 ,  H01L21/2885 ,  H01L21/67011 ,  H01L31/022425 ,  H05K3/241 ,  Y02E10/50

Abstract: Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.

Abstract translation: 本发明的实施方案涉及将铜电镀到基底的至少一个表面上的方法，其中邻近电镀的至少一个表面（即，阴极）和电化学电池的阳极形成更均匀的双电层 ， 分别。 在一个实施方案中，电镀铜可以基本上不含枝晶，表现出高度的（111）晶体织构，和/或以高沉积速率（例如，约6μm/分钟或更高）电镀，由 在阳极处的至少一个表面处的阴极电流密度与阳极电流密度的比至少为约20℃的条件下对铜进行电镀。在另一个实施方案中，多孔阳极膜可以形成在可消耗的铜阳极上 使用促进形成邻近阳极的更均匀的电双层的长调理过程。

公开(公告)号：US08262894B2

公开(公告)日：2012-09-11

申请号：US12433657

申请日：2009-04-30

Applicant: Xingling Xu ,  Eric Webb

Inventor： Xingling Xu ,  Eric Webb

IPC: C25D3/38 ,  C25D21/18 ,  C25D5/02

CPC classification number: C25D3/38 ,  C25D17/00 ,  C25D17/001 ,  C25D21/14 ,  H01L21/2885 ,  H05K3/423

Abstract: A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.

Abstract translation: 公开了一种铜电镀浴，其包括含有铜盐和至少一种酸的水溶液和包含固体形式的铜盐的容器。 容器向水溶液中提供铜离子以将水溶液的铜离子浓度保持在饱和水平，同时将铜盐固体形式保持在容器内。

公开(公告)号：US20090038947A1

公开(公告)日：2009-02-12

申请号：US11890997

申请日：2007-08-07

Applicant: Valery M. Dubin ,  Yingxiang Tao ,  Xingling Xu ,  James D. Blanchard

Inventor： Valery M. Dubin ,  Yingxiang Tao ,  Xingling Xu ,  James D. Blanchard

IPC: C25D21/18 ,  C25D3/38 ,  C25D5/34

CPC classification number: C25D3/38 ,  C25D5/00 ,  C25D21/02

Abstract: In one embodiment of the invention, an electroplating aqueous solution is disclosed. The electroplating aqueous solution includes at least two acids, copper, at least one accelerator agent, and at least two suppressor agents. The at least one accelerator agent provides an acceleration strength of at least about 2.0 and the at least two suppressor agents, collectively, provide a suppression strength of at least about 5.0. Methods of making and using such an electroplating aqueous solution are also disclosed.

Abstract translation: 在本发明的一个实施方案中，公开了电镀水溶液。 电镀水溶液包含至少两种酸，铜，至少一种促进剂和至少两种抑制剂。 所述至少一种促进剂提供至少约2.0的加速强度，并且所述至少两种抑制剂一起提供至少约5.0的抑制强度。 还公开了制造和使用这种电镀水溶液的方法。

公开(公告)号：US08911609B2

公开(公告)日：2014-12-16

申请号：US13452139

申请日：2012-04-20

Applicant: Valery M. Dubin ,  Xingling Xu ,  Yingxiang Tao ,  James D. Blanchard

Inventor： Valery M. Dubin ,  Xingling Xu ,  Yingxiang Tao ,  James D. Blanchard

IPC: C25D3/38 ,  H01L21/288 ,  H01L31/0224 ,  C25D17/10 ,  C25D17/12 ,  C25D5/00 ,  C25D17/00 ,  H01L21/67 ,  H05K3/24 ,  C25D5/18

CPC classification number: C25D3/38 ,  C25D5/00 ,  C25D5/02 ,  C25D5/18 ,  C25D17/001 ,  C25D17/10 ,  C25D17/12 ,  H01L21/2885 ,  H01L21/67011 ,  H01L31/022425 ,  H05K3/241 ,  Y02E10/50

Abstract: Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.

Abstract translation: 本发明的实施方案涉及将铜电镀到基底的至少一个表面上的方法，其中邻近电镀的至少一个表面（即，阴极）和电化学电池的阳极形成更均匀的双电层 ， 分别。 在一个实施方案中，电镀铜可以基本上不含枝晶，表现出高度的（111）晶体织构，和/或以高沉积速率（例如，约6μm/分钟或更高）电镀，由 在阳极处的至少一个表面处的阴极电流密度与阳极电流密度的比至少为约20℃的条件下对铜进行电镀。在另一个实施方案中，多孔阳极膜可以形成在可消耗的铜阳极上 使用促进形成邻近阳极的更均匀的电双层的长调理过程。

公开(公告)号：US20100276292A1

公开(公告)日：2010-11-04

申请号：US12433657

申请日：2009-04-30

Applicant: Eric Webb ,  Xingling Xu

Inventor： Eric Webb ,  Xingling Xu

IPC: C25D3/66

CPC classification number: C25D3/38 ,  C25D17/00 ,  C25D17/001 ,  C25D21/14 ,  H01L21/2885 ,  H05K3/423

Abstract: A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.

Abstract translation: 公开了一种铜电镀浴，其包括含有铜盐和至少一种酸的水溶液和包含固体形式的铜盐的容器。 容器向水溶液中提供铜离子以将水溶液的铜离子浓度保持在饱和水平，同时将铜盐固体形式保持在容器内。

公开(公告)号：US20090250352A1

公开(公告)日：2009-10-08

申请号：US12080680

申请日：2008-04-04

Applicant: Valery M. Dubin ,  Xingling Xu ,  Yingxiang Tao ,  James D. Blanchard

Inventor： Valery M. Dubin ,  Xingling Xu ,  Yingxiang Tao ,  James D. Blanchard

IPC: C25D3/38 ,  C25D5/08 ,  C25D5/00

CPC classification number: C25D3/38 ,  C25D5/00 ,  C25D5/02 ,  C25D5/18 ,  C25D17/001 ,  C25D17/10 ,  C25D17/12 ,  H01L21/2885 ,  H01L21/67011 ,  H01L31/022425 ,  H05K3/241 ,  Y02E10/50

Abstract: Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.

Abstract translation: 本发明的实施方案涉及将铜电镀到基底的至少一个表面上的方法，其中邻近电镀的至少一个表面（即，阴极）和电化学电池的阳极形成更均匀的双电层 ， 分别。 在一个实施方案中，电镀铜可以基本上不含枝晶，表现出高度的（111）晶体织构，和/或以高沉积速率（例如，约6mum /分钟或更多）电镀，由 在阳极处的至少一个表面处的阴极电流密度与阳极电流密度的比至少为约20℃的条件下对铜进行电镀。在另一个实施方案中，多孔阳极膜可以形成在可消耗的铜阳极上 使用促进形成邻近阳极的更均匀的电双层的长调理过程。