发明申请
US20120199873A1 METAL SUBSTRATE FOR LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE 审中-公开
用于发光二极管的金属基板,发光二极管以及制造发光二极管的方法

  • 专利标题: METAL SUBSTRATE FOR LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE
  • 专利标题(中): 用于发光二极管的金属基板,发光二极管以及制造发光二极管的方法
  • 申请号: US13500479
    申请日: 2010-09-30
  • 公开(公告)号: US20120199873A1
    公开(公告)日: 2012-08-09
  • 发明人: Atsushi MatsumuraRyouichi Takeuchi
  • 申请人: Atsushi MatsumuraRyouichi Takeuchi
  • 申请人地址: JP Minato-ku, Tokyo
  • 专利权人: SHOWA DENKO K.K.
  • 当前专利权人: SHOWA DENKO K.K.
  • 当前专利权人地址: JP Minato-ku, Tokyo
  • 优先权: JP2009-233748 20091007
  • 国际申请: PCT/JP2010/067069 WO 20100930
  • 主分类号: H01L33/30
  • IPC分类号: H01L33/30 H01L33/48
METAL SUBSTRATE FOR LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE
摘要:
The object of the present invention is to provide a metal substrate for a light-emitting diode having excellent chemical resistance, a light-emitting diode, and a method for manufacturing the light-emitting diode, and the present invention provides a metal substrate for a light-emitting diode including a metal substrate, a compound semiconductor layer having a light-emitting portion, which is joined over the metal substrate via a junction layer, wherein the metal substrate for a light-emitting diode includes a metal plate and a metal protective film which covers at least an upper surface and a lower surface of the metal plate.
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