发明申请
US20120202336A1 METHOD OF FORMING AN ISOLATION STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE 有权
形成隔离结构的方法和形成半导体器件的方法

  • 专利标题: METHOD OF FORMING AN ISOLATION STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE
  • 专利标题(中): 形成隔离结构的方法和形成半导体器件的方法
  • 申请号: US13362142
    申请日: 2012-01-31
  • 公开(公告)号: US20120202336A1
    公开(公告)日: 2012-08-09
  • 发明人: Joo-Sung PARKSe-Myeong JangGil-Sub Kim
  • 申请人: Joo-Sung PARKSe-Myeong JangGil-Sub Kim
  • 优先权: KR10-2011-0011408 20110209
  • 主分类号: H01L21/762
  • IPC分类号: H01L21/762
METHOD OF FORMING AN ISOLATION STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE
摘要:
A method of forming an isolation structure includes forming a trench at an upper portion of a substrate, forming a first oxide layer on an inner wall of the trench, oxidizing a portion of the substrate adjacent to the trench to form a second oxide layer such that the portion of the substrate adjacent to the trench has the first oxide layer thereon, forming a nitride layer on the first oxide layer, and forming an insulation layer pattern on the nitride layer such that the insulation layer pattern fills a remaining portion of the trench.
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