METHOD OF FORMING AN ISOLATION STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD OF FORMING AN ISOLATION STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE 有权
    形成隔离结构的方法和形成半导体器件的方法

    公开(公告)号:US20120202336A1

    公开(公告)日:2012-08-09

    申请号:US13362142

    申请日:2012-01-31

    IPC分类号: H01L21/762

    CPC分类号: H01L21/76229

    摘要: A method of forming an isolation structure includes forming a trench at an upper portion of a substrate, forming a first oxide layer on an inner wall of the trench, oxidizing a portion of the substrate adjacent to the trench to form a second oxide layer such that the portion of the substrate adjacent to the trench has the first oxide layer thereon, forming a nitride layer on the first oxide layer, and forming an insulation layer pattern on the nitride layer such that the insulation layer pattern fills a remaining portion of the trench.

    摘要翻译: 形成隔离结构的方法包括在衬底的上部形成沟槽,在沟槽的内壁上形成第一氧化物层,氧化邻近沟槽的衬底的一部分以形成第二氧化物层,使得 与沟槽相邻的衬底部分具有第一氧化物层,在第一氧化物层上形成氮化物层,并在氮化物层上形成绝缘层图案,使得绝缘层图案填充沟槽的剩余部分。

    Method of forming an isolation structure and method of forming a semiconductor device
    2.
    发明授权
    Method of forming an isolation structure and method of forming a semiconductor device 有权
    形成隔离结构的方法和形成半导体器件的方法

    公开(公告)号:US08697579B2

    公开(公告)日:2014-04-15

    申请号:US13362142

    申请日:2012-01-31

    IPC分类号: H01L21/311

    CPC分类号: H01L21/76229

    摘要: A method of forming an isolation structure includes forming a trench at an upper portion of a substrate, forming a first oxide layer on an inner wall of the trench, oxidizing a portion of the substrate adjacent to the trench to form a second oxide layer such that the portion of the substrate adjacent to the trench has the first oxide layer thereon, forming a nitride layer on the first oxide layer, and forming an insulation layer pattern on the nitride layer such that the insulation layer pattern fills a remaining portion of the trench.

    摘要翻译: 形成隔离结构的方法包括在衬底的上部形成沟槽,在沟槽的内壁上形成第一氧化物层,氧化邻近沟槽的衬底的一部分以形成第二氧化物层,使得 与沟槽相邻的衬底部分具有第一氧化物层,在第一氧化物层上形成氮化物层,并在氮化物层上形成绝缘层图案,使得绝缘层图案填充沟槽的剩余部分。

    Method for fabricating multiple FETs of different types
    3.
    发明申请
    Method for fabricating multiple FETs of different types 有权
    制造不同类型多个FET的方法

    公开(公告)号:US20070298599A1

    公开(公告)日:2007-12-27

    申请号:US11804875

    申请日:2007-05-21

    IPC分类号: H01L21/8232

    CPC分类号: H01L21/823412

    摘要: For fabricating multiple field effect transistors (FETs), a first conductive layer is deposited over first and second active regions of a semiconductor substrate. The first conductive layer is patterned over the second active region to form mold structures. Mask structures are formed between the mold structures. The second active region is patterned using the mask structures or using spacers formed at sidewalls of the mold structures to form multiple fins of a field effect transistor of a fin type. The first conductive layer is patterned over the first active region to form a gate of another field effect transistor of a different type.

    摘要翻译: 为了制造多个场效应晶体管(FET),第一导电层沉积在半导体衬底的第一和第二有源区上。 在第二有源区上形成第一导电层以形成模具结构。 在模具结构之间形成掩模结构。 使用掩模结构或使用形成在模具结构的侧壁处的间隔来形成第二有源区,以形成翅片型场效应晶体管的多个鳍。 在第一有源区上图案化第一导电层以形成不同类型的另一场效应晶体管的栅极。

    Method for forming lower electrode of cylinder-shaped capacitor preventing twin bit failure
    4.
    发明授权
    Method for forming lower electrode of cylinder-shaped capacitor preventing twin bit failure 失效
    用于形成圆柱形电容器的下电极的方法,其防止双位故障

    公开(公告)号:US06458653B1

    公开(公告)日:2002-10-01

    申请号:US10040866

    申请日:2001-12-27

    申请人: Se-Myeong Jang

    发明人: Se-Myeong Jang

    IPC分类号: H01L218242

    CPC分类号: H01L28/91 H01L21/76804

    摘要: A method for forming a lower electrode of a cylinder-shaped capacitor is provided to prevent etch skew and twin bit failure. The method includes sequentially forming a buffer layer and an etch stopper on a semiconductor substrate including a conductive region, forming a sacrificial dielectric layer on the etch stopper, forming a first opening within the sacrificial dielectric layer by etching a portion of the sacrificial dielectric layer using the etch stopper, depositing a slope-improving layer for improving sidewall slope of the first opening, forming a second opening by etching a portion of the slope-improving layer, the etch stopper and the buffer layer under the first opening and exposing the conductive region to which the cylinder-shaped capacitor is electrically connected, depositing a conductive layer for forming cylinder-shaped lower electrodes on a surface of the second opening, and forming the cylinder-shaped lower electrodes separated from each other.

    摘要翻译: 提供一种用于形成圆柱形电容器的下电极的方法,以防止蚀刻偏斜和双位故障。 该方法包括在包括导电区域的半导体衬底上顺序地形成缓冲层和蚀刻停止层,在蚀刻停止层上形成牺牲介电层,通过用牺牲介电层中的一部分蚀刻牺牲介电层的一部分, 蚀刻停止器,沉积用于改善第一开口的侧壁倾斜度的斜坡改进层,通过蚀刻斜面改善层的一部分,蚀刻停止层和第一开口下方的缓冲层形成第二开口,并使导电区域 所述圆筒形电容器电连接到所述第一开口,在所述第二开口的表面上沉积用于形成圆柱形下电极的导电层,并且形成彼此分离的所述圆筒形下电极。

    Method of fabricating FinFET devices
    5.
    发明授权
    Method of fabricating FinFET devices 有权
    FinFET器件的制造方法

    公开(公告)号:US08497175B2

    公开(公告)日:2013-07-30

    申请号:US12766055

    申请日:2010-04-23

    IPC分类号: H01L21/8234

    摘要: A semiconductor device is fabricating using a photoresist mask pattern, and selectively removing portions of a liner nitride layer in a cell region and a peripheral circuit region. A modified FinFET is formed to reduce the influence of signals transmitted by adjacent gate lines in a cell region. A double FinFET and a substantially planar MOSFET are formed in a core region and in a peripheral region, respectively, concurrently with the formation of the modified FinFET.

    摘要翻译: 使用光致抗蚀剂掩模图案制造半导体器件,并且选择性地去除单元区域和外围电路区域中的衬里氮化物层的部分。 形成改进的FinFET以减小由相邻栅极线在单元区域中传输的信号的影响。 在形成改进的FinFET的同时,在芯区域和周边区域分别形成双FinFET和基本上平面的MOSFET。

    Method for fabricating multiple FETs of different types
    7.
    发明授权
    Method for fabricating multiple FETs of different types 有权
    制造不同类型多个FET的方法

    公开(公告)号:US07700445B2

    公开(公告)日:2010-04-20

    申请号:US11804875

    申请日:2007-05-21

    IPC分类号: H01L21/336

    CPC分类号: H01L21/823412

    摘要: For fabricating multiple field effect transistors (FETs), a first conductive layer is deposited over first and second active regions of a semiconductor substrate. The first conductive layer is patterned over the second active region to form mold structures. Mask structures are formed between the mold structures. The second active region is patterned using the mask structures or using spacers formed at sidewalls of the mold structures to form multiple fins of a field effect transistor of a fin type. The first conductive layer is patterned over the first active region to form a gate of another field effect transistor of a different type.

    摘要翻译: 为了制造多个场效应晶体管(FET),第一导电层沉积在半导体衬底的第一和第二有源区上。 在第二有源区上形成第一导电层以形成模具结构。 在模具结构之间形成掩模结构。 使用掩模结构或使用形成在模具结构的侧壁处的间隔来形成第二有源区,以形成翅片型场效应晶体管的多个鳍。 在第一有源区上图案化第一导电层以形成不同类型的另一场效应晶体管的栅极。

    Method of fabricating transistor of DRAM semiconductor device
    8.
    发明授权
    Method of fabricating transistor of DRAM semiconductor device 有权
    制造DRAM半导体器件晶体管的方法

    公开(公告)号:US07223649B2

    公开(公告)日:2007-05-29

    申请号:US10922055

    申请日:2004-08-18

    摘要: Embodiments prevent or substantially reduce diffusion of a P-type impurity into a channel region in a PMOS transistor having a dual gate. Some embodiments include forming a device isolation film on a semiconductor substrate, forming a channel impurity region in an active region of the semiconductor substrate, and forming a gate insulation layer including a silicon oxide layer and a silicon oxide nitride layer on the semiconductor substrate. Also, the embodiments can include forming a polysilicon layer containing an N-type impurity on the gate insulation layer, and forming a gate electrode by selectively ion-implanting a P-type impurity into the polysilicon layer formed in a PMOS transistor region of the circuit region. The embodiments further include forming a conductive metal layer and a gate upper insulation layer on the gate electrode, and forming a gate stack in a gate region.

    摘要翻译: 实施例防止或基本上减少P型杂质扩散到具有双栅极的PMOS晶体管中的沟道区域中。 一些实施例包括在半导体衬底上形成器件隔离膜,在半导体衬底的有源区中形成沟道杂质区,并在半导体衬底上形成包括氧化硅层和氧化硅氮化物层的栅极绝缘层。 此外,实施例可以包括在栅极绝缘层上形成含有N型杂质的多晶硅层,并且通过选择性地将P型杂质离子注入形成在电路的PMOS晶体管区域中的多晶硅层中来形成栅电极 地区。 实施例还包括在栅电极上形成导电金属层和栅极上绝缘层,以及在栅极区域中形成栅叠层。

    Magnetoresistive random access memory devices and methods of manufacturing the same
    9.
    发明授权
    Magnetoresistive random access memory devices and methods of manufacturing the same 有权
    磁阻随机存取存储器件及其制造方法

    公开(公告)号:US09570510B2

    公开(公告)日:2017-02-14

    申请号:US14724725

    申请日:2015-05-28

    摘要: An MRAM device may include semiconductor structures, a common source region, a drain region, a channel region, gate structures, word line structures, MTJ structures, and bit line structures arranged on a substrate. Each of the semiconductor structures may include a first semiconductor pattern having a substantially linear shape extending in a first direction that is substantially parallel to a top surface of the substrate, and a plurality of second patterns that each extend in a third direction substantially perpendicular to the top surface of the substrate. A common source region and drain region may be formed in each of the semiconductor structures to be spaced apart from each other in the third direction, and the channel region may be arranged between the common source region and the drain region. Gate structures may be formed between adjacent second semiconductor patterns in the second direction. Word line structures may electrically connect gate structures arranged in the first direction to each other. MTJ structures may be electrically connected to corresponding ones of the second semiconductor patterns. Each bit line structure may electrically connect two adjacent MTJ structures in the first direction to each other.

    摘要翻译: MRAM器件可以包括布置在衬底上的半导体结构,公共源极区,漏极区,沟道区,栅极结构,字线结构,MTJ结构和位线结构。 每个半导体结构可以包括具有基本上线性形状的第一半导体图案,该第一半导体图案沿着基本上平行于基板的顶表面的第一方向延伸,以及多个第二图案,每个第二图案沿基本上垂直于基板的第三方向延伸 衬底的顶表面。 可以在每个半导体结构中形成公共源极区域和漏极区域,以在第三方向上彼此间隔开,并且沟道区域可以布置在公共源极区域和漏极区域之间。 可以在相邻的第二半导体图案之间沿第二方向形成栅极结构。 字线结构可以将布置在第一方向上的栅极结构彼此电连接。 MTJ结构可以电连接到相应的第二半导体图案。 每个位线结构可以将第一方向上的两个相邻的MTJ结构彼此电连接。