- 专利标题： SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS
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申请号： US13456968申请日： 2012-04-26
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公开(公告)号： US20120205791A1公开(公告)日： 2012-08-16
- 发明人: Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
- 申请人： Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
- 主分类号： H01L25/07
- IPC分类号： H01L25/07 ; H01L23/48
摘要：
A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip opposite the first side.
公开/授权文献
- US08338961B2 Semiconductor chip with reinforcing through-silicon-vias 公开/授权日：2012-12-25
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