Invention Application
US20120205797A1 BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME
审中-公开
具有相同功能的BUMP和SEMICONDUCTOR DEVICE
- Patent Title: BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME
- Patent Title (中): 具有相同功能的BUMP和SEMICONDUCTOR DEVICE
-
Application No.: US13339123Application Date: 2011-12-28
-
Publication No.: US20120205797A1Publication Date: 2012-08-16
- Inventor: Jin Ho BAE , Myung Gun PARK
- Applicant: Jin Ho BAE , Myung Gun PARK
- Applicant Address: KR Icheon-si
- Assignee: HYNIX SEMICONDUCTOR INC.
- Current Assignee: HYNIX SEMICONDUCTOR INC.
- Current Assignee Address: KR Icheon-si
- Priority: KR10-2011-0013241 20110215
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
A bump includes a metal pillar formed over a structural body; and a diffusion barrier member formed to cover at least a portion of a side surface of the metal pillar.
Information query
IPC分类:
