发明申请
- 专利标题: COMPONENT-MOUNTING DEVICE, COMPONENT-MOUNTING SYSTEM, AND COMPONENT-MOUNTING METHOD
- 专利标题(中): 组件安装设备,组件安装系统和组件安装方法
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申请号: US13503706申请日: 2010-10-20
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公开(公告)号: US20120206732A1公开(公告)日: 2012-08-16
- 发明人: Hideki Sumi , Yoshiaki Awata
- 申请人: Hideki Sumi , Yoshiaki Awata
- 申请人地址: JP Osaka
- 专利权人: PANASONIC CORPORATION
- 当前专利权人: PANASONIC CORPORATION
- 当前专利权人地址: JP Osaka
- 优先权: JP2009-245135 20091026
- 国际申请: PCT/JP2010/006233 WO 20101020
- 主分类号: G01B11/02
- IPC分类号: G01B11/02
摘要:
A challenge to be met by the present invention is to provide a component mounting device, a component mounting system, and a component mounting method that make it possible to correctly position a substrate at a working location and mount components on the substrate even when components mounted on the substrate project outside from an end of the substrate in a direction parallel to a substrate conveyance path. When a front end portion (PbT) of a substrate (Pb) conveyed by a substrate conveyance path (13) is detected to have reached inspection light (L), operation of the substrate conveyance path (13) is immediately halted. When a front end portion (PtT) of a projecting portion H of a component (Pt) mounted on the substrate Pb is detected to have reached the inspection light (L), the substrate conveyance path (13) is activated in such a way that the substrate (Pb) moves in the direction of projection of the projecting portion (H) over a distance equivalent to a projection length (α) of the projecting portion (H) reached the inspection light (L) and is subsequently stopped, thereby positioning the substrate (Pb).
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