Invention Application
US20120206891A1 CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD
有权
电路板和具有安装在电路板上的组件的半导体器件
- Patent Title: CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON CIRCUIT BOARD
- Patent Title (中): 电路板和具有安装在电路板上的组件的半导体器件
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Application No.: US13504281Application Date: 2010-10-28
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Publication No.: US20120206891A1Publication Date: 2012-08-16
- Inventor: Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
- Applicant: Shingo Yoshioka , Hiroaki Fujiwara , Hiromitsu Takashita , Tsuyoshi Takeda
- Priority: JP2009251269 20091030; JP2009251378 20091030; JP2009253130 20091104; JP2009253501 20091104; JP2009253502 20091104
- International Application: PCT/JP2010/006378 WO 20101028
- Main IPC: H05K7/06
- IPC: H05K7/06 ; H05K1/02
Abstract:
A circuit board H10 according to the present invention is a circuit board H10 in which an electric circuit H6 including a wiring section H6a and a pad section H6b is provided in the surface of an insulating base substrate H1. The electric circuit H6 is configured such that a conductor H5 is embedded in a circuit recess H3 formed in the surface of the insulating base substrate H1, and the surface roughness of the conductor H5 is different in the wiring section H6a and the pad section H6b of the electric circuit H6. In this case, it is preferable that the surface roughness of the conductor H5 in the pad section H6b is greater than the surface roughness of the conductor H5 in the wiring section H6a.
Public/Granted literature
- US08929092B2 Circuit board, and semiconductor device having component mounted on circuit board Public/Granted day:2015-01-06
Information query
