公开(公告)号：US08929092B2

公开(公告)日：2015-01-06

申请号：US13504281

申请日：2010-10-28

申请人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC分类号： H05K7/00 ,  H05K3/10 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H05K3/38 ,  H05K3/18

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/107 ,  H05K3/184 ,  H05K3/38 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/0565 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

摘要： A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.

摘要翻译： 电路板包括在绝缘基底的表面上具有布线部分和焊盘部分的电路。 电路被配置为使得导体嵌入形成在基底绝缘体的表面中的电路凹槽中，并且导体的表面粗糙度在电路的布线部分和焊盘部分中是不同的。 在这种情况下，优选的是，焊盘部中的导体的表面粗糙度大于布线部中的导体的表面粗糙度。

公开(公告)号：US08516145B2

公开(公告)日：2013-08-20

申请号：US12838210

申请日：2010-07-16

申请人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

发明人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

IPC分类号： G06F15/16

CPC分类号： G03F7/70525 ,  G03F7/70508 ,  G03F7/70991

摘要： An apparatus which transmits data generated by a device manufacturing apparatus to at least one terminal, comprises a communication unit, a transmission request processor configured to accept or reject a transmission request which the communication unit has received from the terminal, and a transmission controller configured to control the communication unit to transmit, in response to a transmission request accepted by the transmission request processor, data corresponding to the transmission request to a terminal, of the at least one terminal, which has transmitted the transmission request, wherein the transmission request processor accepts a new transmission request if a sum of transmission rates of the respective data concurrently transmitted from the communication unit in response to transmission requests which the transmission request processor has already accepted and a transmission rate at which data is transmitted in response to the new transmission request does not exceed a preset allowable transmission rate.

摘要翻译： 将由装置制造装置生成的数据发送到至少一个终端的装置包括通信单元，被配置为接收或拒绝通信单元从终端接收到的发送请求的发送请求处理器，以及配置为 控制所述通信单元响应于所述传输请求处理器接受的传输请求，将已经发送了所述传输请求的所述至少一个终端的发送请求的数据发送到终端，其中，所述传输请求处理器接受 如果根据传输请求处理器已经接受的传输请求以及响应于新的传输请求发送数据的传输速率而从通信单元同时发送的各个数据的传输速率的总和，则发送新的传输请求 不超过 复位允许传输速率。

公开(公告)号：US20110029685A1

公开(公告)日：2011-02-03

申请号：US12838210

申请日：2010-07-16

申请人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

发明人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

IPC分类号： G06F15/16

CPC分类号： G03F7/70525 ,  G03F7/70508 ,  G03F7/70991

摘要： An apparatus which transmits data generated by a device manufacturing apparatus to at least one terminal, comprises a communication unit, a transmission request processor configured to accept or reject a transmission request which the communication unit has received from the terminal, and a transmission controller configured to control the communication unit to transmit, in response to a transmission request accepted by the transmission request processor, data corresponding to the transmission request to a terminal, of the at least one terminal, which has transmitted the transmission request, wherein the transmission request processor accepts a new transmission request if a sum of transmission rates of the respective data concurrently transmitted from the communication unit in response to transmission requests which the transmission request processor has already accepted and a transmission rate at which data is transmitted in response to the new transmission request does not exceed a preset allowable transmission rate.

摘要翻译： 将由装置制造装置生成的数据发送到至少一个终端的装置包括通信单元，被配置为接收或拒绝通信单元从终端接收到的发送请求的发送请求处理器，以及配置为 控制所述通信单元响应于所述传输请求处理器接受的传输请求，将已经发送了所述传输请求的所述至少一个终端的发送请求的数据发送到终端，其中，所述传输请求处理器接受 如果根据传输请求处理器已经接受的传输请求以及响应于新的传输请求发送数据的传输速率而从通信单元同时发送的各个数据的传输速率的总和，则新的传输请求 不超过 复位允许传输速率。

公开(公告)号：US20100218982A1

公开(公告)日：2010-09-02

申请号：US12675856

申请日：2008-06-30

申请人： Hiroaki Fujiwara ,  Masao Imai ,  Yuki Kitai

发明人： Hiroaki Fujiwara ,  Masao Imai ,  Yuki Kitai

IPC分类号： H05K1/09 ,  C08L63/00 ,  C08K5/02 ,  C08K5/3417 ,  C08K5/06 ,  C08K5/13 ,  C08K3/36 ,  C08K3/22 ,  B32B27/04 ,  B32B15/092

CPC分类号： H05K1/0373 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/03 ,  C08K5/06 ,  C08K5/315 ,  C08K5/3417 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C09D163/00 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31529 ,  C08L2666/14 ,  C08L2666/22

摘要： It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this object, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, wherein all of the components (A) to (C) are dissolved in the resin varnish, while the component (E) is dispersed without being dissolved in the resin varnish.

摘要翻译： 本发明的目的是提供一种含有环氧化合物，低分子量苯酚改性聚苯醚和氰酸酯化合物作为必要组分的环氧树脂组合物，该环氧树脂组合物具有优异的介电特性并表现出高热 阻力同时保持阻燃性。 为了达到这个目的，本发明的环氧树脂组合物是一种热固性树脂组合物，其由含有（A）数均分子量为1000以下并且含有至少两个环氧基的环氧化合物的树脂清漆组成 分子，不含有任何卤素原子，（B）数均分子量为5000以下的聚苯醚，（C）氰酸酯化合物，（D）固化催化剂和（E）卤素阻燃剂，其中全部 的组分（A）至（C）溶解在树脂清漆中，而组分（E）分散而不溶解在树脂清漆中。

公开(公告)号：US20080168413A1

公开(公告)日：2008-07-10

申请号：US11885831

申请日：2006-01-20

申请人： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

发明人： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

IPC分类号： G06F17/50 ,  H05K3/32

CPC分类号： G06F17/5018 ,  G06F2217/40 ,  G06F2217/80 ,  H05K1/181 ,  H05K3/0005

摘要： A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.

摘要翻译： 一种用于分析组件安装板的方法，包括用于形成多层布线板的多层基板外壳模型的步骤（A），用于形成由元件划分线划分的多层部件壳模型的步骤（B） 多层布线基板的表面的成分，对多层基板外壳模型中的部件的安装位置进行再分割的工序（C），以及通过将基板的中性面粘合而形成分析模型的工序（D） 通过束元件和固体元件中的一个，即与元件的安装条件相当的结合元件，其中分析的精度被增强，同时通过在分析模型赋予边界条件的同时进行计算来降低计算成本。

公开(公告)号：US08895552B2

公开(公告)日：2014-11-25

申请号：US13819881

申请日：2011-09-02

申请人： Yoshihiro Horiuchi ,  Hiroaki Fujiwara ,  Hitoshi Suda ,  Izumi Sasaki ,  Mitsutaka Iwata ,  Kiyoto Sawamura

发明人： Yoshihiro Horiuchi ,  Hiroaki Fujiwara ,  Hitoshi Suda ,  Izumi Sasaki ,  Mitsutaka Iwata ,  Kiyoto Sawamura

IPC分类号： A61K31/535 ,  C07D277/00

CPC分类号： C07D409/06 ,  C07C233/74 ,  C07C235/84 ,  C07C255/57 ,  C07C2603/74 ,  C07D207/32 ,  C07D207/335 ,  C07D207/34 ,  C07D213/50 ,  C07D213/61 ,  C07D213/82 ,  C07D231/12 ,  C07D233/64 ,  C07D263/32 ,  C07D277/20 ,  C07D277/28 ,  C07D277/30 ,  C07D277/56 ,  C07D295/10 ,  C07D295/155 ,  C07D305/08 ,  C07D307/20 ,  C07D307/78 ,  C07D307/81 ,  C07D309/12 ,  C07D317/48 ,  C07D319/18 ,  C07D333/20 ,  C07D333/38 ,  C07D333/58 ,  C07D409/14

摘要： Provided is a compound represented by formula (1) or a pharmacologically acceptable salt thereof. (In the formula, A is C6-10 arylene, etc.; R1a, R1b and R1c each independently is a hydrogen atom, a halogen atom, a C1-4 alkyl group, a C1-4 alkoxy group, etc.; R2 is an optionally substituted C6-10 aryl group, an optionally substituted 5- to 12-membered monocyclic or polycyclic heteroaryl group, an optionally substituted C7-16 aralkyl group, etc.; m is 0, etc.; n is an integer of 0 to 2.)

摘要翻译： 提供由式（1）表示的化合物或其药理学上可接受的盐。 （式中，A为C6-10亚芳基等; R1a，R1b和R1c各自独立地为氢原子，卤素原子，C1-4烷基，C1-4烷氧基等; R2为 任选取代的C 6-10芳基，任选取代的5至12元单环或多环杂芳基，任选取代的C7-16芳烷基等; m为0等; n为0至 2.）

公开(公告)号：US20130217692A1

公开(公告)日：2013-08-22

申请号：US13819881

申请日：2011-09-02

申请人： Yoshihiro Horiuchi ,  Hiroaki Fujiwara ,  Hitoshi Suda ,  Izumi Sasaki ,  Mitsutaka Iwata ,  Kiyoto Sawamura

发明人： Yoshihiro Horiuchi ,  Hiroaki Fujiwara ,  Hitoshi Suda ,  Izumi Sasaki ,  Mitsutaka Iwata ,  Kiyoto Sawamura

IPC分类号： C07D409/06 ,  C07D295/155 ,  C07D277/56 ,  C07D213/50 ,  C07C233/74 ,  C07D333/38

CPC分类号： C07D409/06 ,  C07C233/74 ,  C07C235/84 ,  C07C255/57 ,  C07C2603/74 ,  C07D207/32 ,  C07D207/335 ,  C07D207/34 ,  C07D213/50 ,  C07D213/61 ,  C07D213/82 ,  C07D231/12 ,  C07D233/64 ,  C07D263/32 ,  C07D277/20 ,  C07D277/28 ,  C07D277/30 ,  C07D277/56 ,  C07D295/10 ,  C07D295/155 ,  C07D305/08 ,  C07D307/20 ,  C07D307/78 ,  C07D307/81 ,  C07D309/12 ,  C07D317/48 ,  C07D319/18 ,  C07D333/20 ,  C07D333/38 ,  C07D333/58 ,  C07D409/14

摘要： Provided is a compound represented by formula (1) or a pharmacologically acceptable salt thereof. (In the formula, A is C6-10 arylene, etc.; R1a, R1b and R1c each independently is a hydrogen atom, a halogen atom, a C1-4 alkyl group, a C1-4 alkoxy group, etc.; R2 is an optionally substituted C6-10 aryl group, an optionally substituted 5- to 12-membered monocyclic or polycyclic heteroaryl group, an optionally substituted C7-16 aralkyl group, etc.; m is 0, etc.; n is an integer of 0 to 2.)

摘要翻译： 提供由式（1）表示的化合物或其药理学上可接受的盐。 （式中，A为C6-10亚芳基等; R1a，R1b和R1c各自独立地为氢原子，卤素原子，C1-4烷基，C1-4烷氧基等; R2为 任选取代的C 6-10芳基，任选取代的5至12元单环或多环杂芳基，任选取代的C7-16芳烷基等; m为0等; n为0至 2.）

公开(公告)号：US08450032B2

公开(公告)日：2013-05-28

申请号：US12666651

申请日：2008-06-27

申请人： Kumiko Fujiwara ,  Teruyuki Mitsumori ,  Hiroaki Fujiwara

发明人： Kumiko Fujiwara ,  Teruyuki Mitsumori ,  Hiroaki Fujiwara

IPC分类号： G03G5/00

摘要： The invention provides an electrophotographic photoreceptor for use in an image-forming apparatus comprising a charging unit which charges an electrophotographic photoreceptor, an exposure unit which exposes the charged electrophotographic photoreceptor to light to form an electrostatic latent image on the electrophotographic photoreceptor, and a developing unit which develops the electrostatic latent image, wherein the electrophotographic photoreceptor comprises a conductive substrate and a photosensitive layer and the photosensitive layer contains a compound represented by the following formula (1).

公开(公告)号：US08272126B2

公开(公告)日：2012-09-25

申请号：US12431950

申请日：2009-04-29

申请人： Shingo Yoshioka ,  Hiroaki Fujiwara

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara

IPC分类号： H05K3/02

CPC分类号： H05K3/184 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/15173 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/023 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/381 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4661 ,  H05K2201/09381 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0565 ,  H05K2203/161 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

摘要： An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the swellable resin film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the swellable resin film.

摘要翻译： 本发明的一个方面的目的是提供一种电路板的制造方法，其能够高精度地保存电路剖面，并且通过加法处理给出具有所需深度的电路以准备精细电路。 在本发明的一个方面中，制造多层电路板的方法包括：在绝缘性基板的表面上形成可溶胀树脂膜的成膜工序;形成电路槽的电路槽形成工序，其深度等于 或大于可溶胀树脂膜的外表面上的可溶胀树脂膜的厚度，在电路槽的表面和可溶胀树脂膜的表面上沉积电镀催化剂或其前体的催化剂沉积步骤， 使用特定液体使溶胀性树脂膜溶胀，然后将所述溶胀树脂膜与所述绝缘性基板表面分离的膜分离工序，以及仅在所述镀催化剂或所述镀层的区域形成无电镀膜的电镀处理工序 在可溶胀树脂膜分离之后，由电镀催化剂前体形成的催化剂保持未分离。

公开(公告)号：US20120206891A1

公开(公告)日：2012-08-16

申请号：US13504281

申请日：2010-10-28

申请人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC分类号： H05K7/06 ,  H05K1/02

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/107 ,  H05K3/184 ,  H05K3/38 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/0565 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

摘要： A circuit board H10 according to the present invention is a circuit board H10 in which an electric circuit H6 including a wiring section H6a and a pad section H6b is provided in the surface of an insulating base substrate H1. The electric circuit H6 is configured such that a conductor H5 is embedded in a circuit recess H3 formed in the surface of the insulating base substrate H1, and the surface roughness of the conductor H5 is different in the wiring section H6a and the pad section H6b of the electric circuit H6. In this case, it is preferable that the surface roughness of the conductor H5 in the pad section H6b is greater than the surface roughness of the conductor H5 in the wiring section H6a.

摘要翻译： 根据本发明的电路板H10是电路板H10，其中包括布线部分H6a和焊盘部分H6b的电路H6设置在绝缘基板H1的表面中。 电路H6被配置为使得导体H5嵌入在形成在绝缘性基板H1的表面上的电路凹部H3中，并且导体H5的表面粗糙度在布线部H6a和焊盘部H6b中不同 电路H6。 在这种情况下，优选的是，焊盘部H6b中的导体H5的表面粗糙度大于布线部H6a中的导体H5的表面粗糙度。