发明申请
- 专利标题: COMPONENT AND A METHOD OF PROCESSING A COMPONENT
- 专利标题(中): 组件和处理组件的方法
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申请号: US13032821申请日: 2011-02-23
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公开(公告)号: US20120214019A1公开(公告)日: 2012-08-23
- 发明人: Dechao LIN , Yan Cui , Srikanth Chandrudu Kottilingam , Ganjiang Feng
- 申请人: Dechao LIN , Yan Cui , Srikanth Chandrudu Kottilingam , Ganjiang Feng
- 申请人地址: US NY Schenectady
- 专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人地址: US NY Schenectady
- 主分类号: B23K31/02
- IPC分类号: B23K31/02 ; B32B15/01
摘要:
A component and a method of processing a component are disclosed. The method includes providing a base metal having a feature, removing the feature to form a processed region, applying a first layer to the processed region, and applying a second layer to the first layer. The base metal, the first layer, and the second layer each have predetermined thermal expansion coefficients, yield strengths, and elongations. The processed component includes the first layer applied to a processed region of the base metal and a second layer applied to the first layer.
公开/授权文献
- US08974865B2 Component and a method of processing a component 公开/授权日:2015-03-10
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