发明申请
US20120217626A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
半导体器件及制造半导体器件的方法
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件及制造半导体器件的方法
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申请号： US13353666申请日： 2012-01-19
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公开(公告)号： US20120217626A1公开(公告)日： 2012-08-30
- 发明人: Taiji SAKAI , Kazukiyo Joshin , Tadahiro Imada , Nobuhiro Imaizumi , Keishiro Okamoto
- 申请人： Taiji SAKAI , Kazukiyo Joshin , Tadahiro Imada , Nobuhiro Imaizumi , Keishiro Okamoto
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2011-040464 20110225
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/58
摘要：
A method for manufacturing a semiconductor device, includes: placing a seal layer including a connection conductive film on the surface so that the connection conductive film is in contact with an electrode of a semiconductor element and a lead; electrically coupling the electrode and the lead through the connection conductive film; and sealing the semiconductor element by the seal layer.
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