发明申请
- 专利标题： ULTRAHIGH-FREQUENCY PACKAGE MODULE
- 专利标题（中）： ULTRAHIGH-频率封装模块
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申请号： US13420152申请日： 2012-03-14
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公开(公告)号： US20120235880A1公开(公告)日： 2012-09-20
- 发明人: Joon-Il KIM , Shin-Hee CHO , Young-Min LEE , Jae-Hyuck LEE , Kyu-Sub KWAK , Sung-Ku YEO
- 申请人： Joon-Il KIM , Shin-Hee CHO , Young-Min LEE , Jae-Hyuck LEE , Kyu-Sub KWAK , Sung-Ku YEO
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR10-2011-0022586 20110314
- 主分类号： H01Q1/24
- IPC分类号： H01Q1/24
摘要：
An ultrahigh-frequency package module is provided, including a first substrate having a plurality of power lines and a plurality of signal lines, and one or more second substrates provided on one surface of the first substrate and each being provided with at least one antenna. The second substrates are independently arranged one by one in a grid pattern along one surface of the first substrate.
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