发明申请
- 专利标题： ELECTRONIC PACKAGE STRUCTURE
- 专利标题（中）： 电子包装结构
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申请号： US13485954申请日： 2012-06-01
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公开(公告)号： US20120236519A1公开(公告)日： 2012-09-20
- 发明人: Da-Jung Chen , Chun-Tiao Liu , BAU-RU LU
- 申请人： Da-Jung Chen , Chun-Tiao Liu , BAU-RU LU
- 申请人地址： TW Hsinchu
- 专利权人： CYNTEC CO., LTD
- 当前专利权人： CYNTEC CO., LTD
- 当前专利权人地址： TW Hsinchu
- 优先权： TW97105555 20080218
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; H05K3/30
摘要：
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
公开/授权文献
- US09001527B2 Electronic package structure 公开/授权日：2015-04-07
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