公开(公告)号：US09514964B2

公开(公告)日：2016-12-06

申请号：US14821812

申请日：2015-08-10

申请人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

发明人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00

CPC分类号： H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

摘要翻译： 公开了一种形成导电结构的方法，所述方法包括以下步骤：形成具有彼此分离的多个金属部件的金属框架; 在所述多个金属部件的顶表面上形成绝缘层; 以及在所述绝缘层上形成导电图案层，用于与所述多个金属部件的至少一部分进行电连接。

公开(公告)号：US09111954B2

公开(公告)日：2015-08-18

申请号：US13180292

申请日：2011-07-11

申请人： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

发明人： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10 ,  H01L23/64 ,  H01L23/552 ,  H01L25/07 ,  H02M3/155 ,  H02M7/00 ,  H01L23/00

CPC分类号： H01L23/645 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1904 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/155 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.

摘要翻译： 电力转换模块包括电路载板，半导体模块和电感模块。 电路载板具有多个接合焊盘。 半导体模块设置在电路承载板的第一表面上。 电感器模块具有多个引脚。 引脚沿着第一方向从电感器模块延伸并与电路载体板上的对应焊盘连接，使得在电感器模块和电路载体板之间限定容纳半导体模块的插座。

公开(公告)号：US20100059870A1

公开(公告)日：2010-03-11

申请号：US12491096

申请日：2009-06-24

申请人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

发明人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3735 ,  H01L23/49531 ,  H01L23/49586 ,  H01L23/62 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

摘要翻译： 提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。 芯片设置在基板上。 引线电连接到基板。 具有顶表面的模制化合物封装芯片，衬底和引线的一部分。 散热装置设置在模塑料的顶表面上。 布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

公开(公告)号：US20080303125A1

公开(公告)日：2008-12-11

申请号：US11847351

申请日：2007-08-30

申请人： DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

摘要翻译： 三维封装结构包括能量存储元件，半导体封装体和屏蔽层。 半导体封装主体具有多个第二导电元件和至少一个控制装置。 储能元件设置在半导体封装主体上。 包括磁性体的能量存储元件电连接到第二导电元件。 半导体封装体或能量存储元件具有多个第一导电元件以与外部器件电连接。 屏蔽层设置在控制部件和磁体的至少一部分之间以抑制或减少来自能量存储元件的EMI（电磁干扰）并获得微小的封装结构。 三维封装结构适用于POL（负载点）转换器。

公开(公告)号：US20080179722A1

公开(公告)日：2008-07-31

申请号：US11930183

申请日：2007-10-31

申请人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

IPC分类号： H01L23/495

CPC分类号： H05K1/141 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0262 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10924 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.

摘要翻译： 提供了包括第一载体，至少一个第一电子元件，至少一个第二电子元件和密封剂的电子封装结构。 第一载体具有与第一载体表面相对的第一载体表面和第二载体表面。 第一电子元件设置在第一承载表面上并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 密封剂至少覆盖第一电子元件，第二电子元件和第一载体的一部分。 电子封装结构的第一载体的空间利用率更高。

公开(公告)号：US20070096293A1

公开(公告)日：2007-05-03

申请号：US11336973

申请日：2006-01-23

申请人： Chau Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

发明人： Chau Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

IPC分类号： H01L23/12 ,  H01L23/52

CPC分类号： H01L23/3107 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.

摘要翻译： 本发明提供了一种用于减小电磁/射频干扰的封装装置，其包括在第一基板的下表面上具有屏蔽结构的第一基板和屏蔽结构上的绝缘层。 第一基板包括在其中填充有导体的通孔。 位于第一基板的底表面上的多个引线框架。 位于两个引线框之间的第二基板。 然后，封装以覆盖上述结构的模塑料形成包装装置。 因此，封装器件的屏蔽路径由多个引线框架，第一基板内的导体，屏蔽结构构成，并且接地以将电磁/射频放出封装器件，因此，电磁 可以减少封装器件的射频干扰。

公开(公告)号：US09142426B2

公开(公告)日：2015-09-22

申请号：US13163770

申请日：2011-06-20

申请人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

发明人： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of forming a conductive pattern on a metallic frame for manufacturing a stack frame for electrical connections is disclosed. In one embodiment, a recess is formed in the metallic frame and a conductive element is bonded in the recess to make a stack frame for electrical connections. In another embodiment, the process can be performed on both top surface and bottom surface of metallic frame to make another stack frame for electrical connections. In yet another embodiment, a package structure and a manufacturing method of forming a conductive pattern on a lead frame for electrical connections are disclosed.

摘要翻译： 公开了一种在用于制造用于电连接的堆叠框架的金属框架上形成导电图案的方法。 在一个实施例中，在金属框架中形成凹部，并且导电元件接合在凹部中以形成用于电连接的堆叠框架。 在另一个实施例中，该过程可以在金属框架的顶表面和底表面上进行以制造用于电连接的另一个堆叠框架。 在另一个实施例中，公开了一种在用于电连接的引线框架上形成导电图案的封装结构和制造方法。

公开(公告)号：US08824165B2

公开(公告)日：2014-09-02

申请号：US13185573

申请日：2011-07-19

申请人： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

发明人： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC分类号： H05K5/02

CPC分类号： H05K1/181 ,  H01F27/027 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

摘要翻译： 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US20130146341A1

公开(公告)日：2013-06-13

申请号：US13323843

申请日：2011-12-13

申请人： DA-JUNG CHEN ,  WEN-HSIUNG LIAO ,  CHUN-FU HU

发明人： DA-JUNG CHEN ,  WEN-HSIUNG LIAO ,  CHUN-FU HU

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H01L24/32 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/2902 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/30181 ,  H01L2224/32225 ,  H01L2224/32505 ,  H01L2224/32507 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83411 ,  H01L2224/83416 ,  H01L2224/83418 ,  H01L2224/83439 ,  H01L2224/83815 ,  H01L2224/8392 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2224/05552

摘要： The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.

摘要翻译： 本发明公开了一种具有覆盖焊料材料的覆盖金属材料的封装结构。 衬底包括第一焊盘和其上的第二焊垫。 衬底上的导电元件包括​​第一电极和第二电极。 焊料材料将第一焊盘和第二焊盘分别电连接到第一电极和第二电极。 覆盖金属材料覆盖焊料金属材料，第一焊盘，第二焊盘，第一电极和第二电极的暴露区域，其中暴露区域包括具有比第二金属材料低的熔点的金属材料。

公开(公告)号：US20120319258A1

公开(公告)日：2012-12-20

申请号：US13163770

申请日：2011-06-20

申请人： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

发明人： BAU-RU LU ,  DA-JUNG CHEN ,  YI-CHENG LIN

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of forming a conductive pattern on a metallic frame for manufacturing a stack frame for electrical connections is disclosed. In one embodiment, a recess is formed in the metallic frame and a conductive element is bonded in the recess to make a stack frame for electrical connections. In another embodiment, the process can be performed on both top surface and bottom surface of metallic frame to make another stack frame for electrical connections. In yet another embodiment, a package structure and a manufacturing method of forming a conductive pattern on a lead frame for electrical connections are disclosed.

摘要翻译： 公开了一种在用于制造用于电连接的堆叠框架的金属框架上形成导电图案的方法。 在一个实施例中，在金属框架中形成凹部，并且导电元件接合在凹部中以形成用于电连接的堆叠框架。 在另一个实施例中，该过程可以在金属框架的顶表面和底表面上进行以制造用于电连接的另一个堆叠框架。 在另一个实施例中，公开了一种在用于电连接的引线框架上形成导电图案的封装结构和制造方法。