According to one embodiment, a flexible wiring module includes a flexible wiring board including a plurality of electrical wirings, a through slit configured to divide the wiring board into a plurality of fins, and a bundling region configured to bundle the plurality of wiring fins. The through slit divides a wiring region of the wiring board into a plurality of wiring fins including a first wiring fin and a second wiring fin having electrical wiring width larger than that of the first wiring fin. The bundling region bundles a laminated portion having at least a portion of the wiring fins laminated in a thickness direction and bundles the fins to cause the second wiring fin to be arranged on at least one of the upper and lower layers of the first wiring fin.