Invention Application
- Patent Title: METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT
- Patent Title (中): 制造非易失性半导体存储元件的方法
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Application No.: US13502769Application Date: 2011-11-10
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Publication No.: US20120238055A1Publication Date: 2012-09-20
- Inventor: Takumi Mikawa , Yukio Hayakawa , Takeki Ninomiya , Yoshio Kawashima
- Applicant: Takumi Mikawa , Yukio Hayakawa , Takeki Ninomiya , Yoshio Kawashima
- Priority: JP2010-254314 20101112
- International Application: PCT/JP2011/006302 WO 20111110
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
An object of the present invention is to provide a method for manufacturing a variable resistance nonvolatile semiconductor memory element which can operate at a low voltage and high speed when initial breakdown is caused, and inhibit oxidization of a contact plug. The method for manufacturing the variable resistance nonvolatile semiconductor memory element, which includes a bottom electrode, a variable resistance layer, and a top electrode which are formed above a contact plug, includes oxidizing to insulate an end portion of the variable resistance layer prior to forming a bottom electrode by patterning a first conductive film.
Public/Granted literature
- US08574957B2 Method for manufacturing nonvolatile semiconductor memory element Public/Granted day:2013-11-05
Information query
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