发明申请
- 专利标题： CIRCUIT BOARD, MANUFACTURING METHOD OF CIRCUIT BOARD, SUSPENSION SUBSTRATE, SUSPENSION, DEVICE-MOUNTED SUSPENSION, AND HARD DISK DRIVE
- 专利标题（中）： 电路板，电路板的制造方法，悬架基板，悬架，装置安装和硬盘驱动
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申请号： US13511793申请日： 2010-12-24
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公开(公告)号： US20120241200A1公开(公告)日： 2012-09-27
- 发明人: Junichi Chiyonaga , Hiromichi Takatsu , Yoichi Miura , Yoichi Nagai
- 申请人： Junichi Chiyonaga , Hiromichi Takatsu , Yoichi Miura , Yoichi Nagai
- 申请人地址： JP Tokyo-to
- 专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人地址： JP Tokyo-to
- 优先权： JP2009-292383 20091224
- 国际申请： PCT/JP2010/073416 WO 20101224
- 主分类号： H05K1/05
- IPC分类号： H05K1/05 ; H05K3/22
摘要：
The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.
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