公开(公告)号：US08609992B2

公开(公告)日：2013-12-17

申请号：US13511793

申请日：2010-12-24

申请人： Junichi Chiyonaga ,  Hiromichi Takatsu ,  Yoichi Miura ,  Yoichi Nagai

发明人： Junichi Chiyonaga ,  Hiromichi Takatsu ,  Yoichi Miura ,  Yoichi Nagai

IPC分类号： H05K1/00

CPC分类号： G11B5/4833 ,  G11B5/486 ,  H05K1/056

摘要： The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.

摘要翻译： 本发明的问题是提供一种电路板，其包括能够在保持机械强度的同时减薄的形状保持单元。 本发明通过提供一种包括金属支撑基板，形成在上述金属支撑基板上的第一绝缘层和形成在上述第一绝缘层上的布线层的电路板来解决上述问题，其中， 在上述金属支撑基板上形成开放区域，电路基板包括具有与上述金属支撑基板接触的第二绝缘层和形成在上述第二绝缘层上的加强层的形状保持单元， 并桥接上述金属支撑基板除以上述开放区域。

公开(公告)号：US20120241200A1

公开(公告)日：2012-09-27

申请号：US13511793

申请日：2010-12-24

申请人： Junichi Chiyonaga ,  Hiromichi Takatsu ,  Yoichi Miura ,  Yoichi Nagai

发明人： Junichi Chiyonaga ,  Hiromichi Takatsu ,  Yoichi Miura ,  Yoichi Nagai

IPC分类号： H05K1/05 ,  H05K3/22

CPC分类号： G11B5/4833 ,  G11B5/486 ,  H05K1/056

摘要： The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.

摘要翻译： 本发明的问题是提供一种电路板，其包括能够在保持机械强度的同时减薄的形状保持单元。 本发明通过提供一种包括金属支撑基板，形成在上述金属支撑基板上的第一绝缘层和形成在上述第一绝缘层上的布线层的电路板来解决上述问题，其中， 在上述金属支撑基板上形成开放区域，电路基板包括具有与上述金属支撑基板接触的第二绝缘层和形成在上述第二绝缘层上的加强层的形状保持单元， 并桥接上述金属支撑基板除以上述开放区域。