发明申请
US20120241714A1 Non-Volatile Resistive Oxide Memory Cells And Methods Of Forming Non-Volatile Resistive Oxide Memory Cells
有权
非挥发性电阻氧化物记忆单元和形成非易失性电阻氧化物记忆单元的方法
- 专利标题: Non-Volatile Resistive Oxide Memory Cells And Methods Of Forming Non-Volatile Resistive Oxide Memory Cells
- 专利标题(中): 非挥发性电阻氧化物记忆单元和形成非易失性电阻氧化物记忆单元的方法
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申请号: US13488190申请日: 2012-06-04
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公开(公告)号: US20120241714A1公开(公告)日: 2012-09-27
- 发明人: Bhaskar Srinivasan , Gurtej Sandhu , John Smythe
- 申请人: Bhaskar Srinivasan , Gurtej Sandhu , John Smythe
- 申请人地址: US ID Boise
- 专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人地址: US ID Boise
- 主分类号: H01L47/00
- IPC分类号: H01L47/00
摘要:
A method of forming a non-volatile resistive oxide memory cell includes forming a first conductive electrode of the memory cell as part of a substrate. The first conductive electrode has an elevationally outermost surface and opposing laterally outermost edges at the elevationally outermost surface in one planar cross section. Multi-resistive state metal oxide-comprising material is formed over the first conductive electrode. Conductive material is deposited over the multi-resistive state metal oxide-comprising material. A second conductive electrode of the memory cell which comprises the conductive material is received over the multi-resistive state metal oxide-comprising material. The forming thereof includes etching through the conductive material to form opposing laterally outermost conductive edges of said conductive material in the one planar cross section at the conclusion of said etching which are received laterally outward of the opposing laterally outermost edges of the first conductive electrode in the one planar cross section.
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