Invention Application
US20120256721A1 SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION 有权
在垂直切换配置中使用电压可切换介质材料的嵌入层的衬底器件或封装

  • Patent Title: SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION
  • Patent Title (中): 在垂直切换配置中使用电压可切换介质材料的嵌入层的衬底器件或封装
  • Application No.: US13524776
    Application Date: 2012-06-15
  • Publication No.: US20120256721A1
    Publication Date: 2012-10-11
  • Inventor: Lex KosowskyRobert FlemingBhret Graydon
  • Applicant: Lex KosowskyRobert FlemingBhret Graydon
  • Main IPC: H01C7/10
  • IPC: H01C7/10
SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION
Abstract:
A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
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