发明申请
US20120257343A1 CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
审中-公开
导电金属微支架，用于增强电气互连
- 专利标题： CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
- 专利标题（中）： 导电金属微支架，用于增强电气互连
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申请号： US13082502申请日： 2011-04-08
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公开(公告)号： US20120257343A1公开(公告)日： 2012-10-11
- 发明人: Rabindra N. Das , Konstantinos I. Papathomas , Mark D. Poliks , Voya R. Markovich
- 申请人： Rabindra N. Das , Konstantinos I. Papathomas , Mark D. Poliks , Voya R. Markovich
- 申请人地址： US NY Endicott
- 专利权人： ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
- 当前专利权人： ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
- 当前专利权人地址： US NY Endicott
- 主分类号： G06F1/16
- IPC分类号： G06F1/16 ; H05K3/00 ; H05K1/09 ; G03F7/20 ; H01B1/02 ; B82Y99/00
摘要：
A method of forming a circuitized substrate for use in electronic packages. A substrate layer is provided that has a copper pad on a surface. A conductive seed layer and a photoresist layer are placed on the surface. The photoresist is developed and conductive material is placed within the developed features and a second conductive material placed on the first conductive material. The photoresist and conductive seed layer are removed to leave a micro-pillar array. The joining and lamination of two circuitized substrate layers utilizes the micro-pillar array for the electrical connection of the circuitized substrate layers.