公开(公告)号：US20130033827A1

公开(公告)日：2013-02-07

申请号：US13198756

申请日：2011-08-05

申请人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

发明人： Rabindra N. Das ,  Voya R. Markovich ,  John M. Lauffer ,  Roy H. Magnuson ,  Konstantinos I. Papathomas ,  Benson Chan

IPC分类号： H05K5/00 ,  H05K1/09 ,  B23K31/02 ,  H05K1/00 ,  H01B1/00 ,  H01B1/02

CPC分类号： H05K1/0313 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/52 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/097 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0257 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.

摘要翻译： 用于连接多级Z轴互连的多层导电粘合剂（ECA）混合物和形成连接多级Z轴互连的ECA的方法。 具有多层能力的ECA包含允许糊料适应特定要求的组成成分的混合物，其中制造电路化衬底组件的方法，其中具有潜在不同的热膨胀系数（CTE）的两个或更多个子组件对齐，并且Z- 在连接期间创建轴互连。 导体的冶金和多层导电浆料的冶金被有效地混合，并且在配合子组件之间使用的可流动的中间电介质流动以接合和围绕导体耦合。

公开(公告)号：US07560501B2

公开(公告)日：2009-07-14

申请号：US12128731

申请日：2008-05-29

申请人： Konstantinos I. Papathomas

发明人： Konstantinos I. Papathomas

IPC分类号： C08K3/14 ,  C08L63/00 ,  C08L71/12 ,  C08L87/00

CPC分类号： H01L23/3185 ,  H01L21/563 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01087 ,  H01L2924/10253 ,  Y10T428/24826 ,  Y10T428/24926 ,  H01L2924/00 ,  H01L2224/0401

摘要： An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, a filler material including substantially spherical or spheroidal particles such that each particle has a diameter less than about 41 microns, and a thermoplastic other than the flexibilizer. The thermoplastic is separated from the cured epoxy or cyanate ester resin. The thermoplastic includes a poly(arylene)ether. The flexibilizer includes bis(2,3-epoxy-2-methylpropyl)ether.

摘要翻译： 密封剂组合物。 密封剂组合物包括由环氧树脂或氰酸酯树脂组成的树脂材料，按组合物重量计约1.0％至约5％的增韧剂，该增韧剂包括含有能够与环氧或氰酸酯树脂反应的官能团的增韧剂 在热诱导固化期间，填充材料包括基本上球形或球形颗粒，使得每个颗粒具有小于约41微米的直径，以及除柔性剂之外的热塑性材料。 将热塑性塑料与固化的环氧树脂或氰酸酯树脂分离。 热塑性塑料包括聚（亚芳基）醚。 增塑剂包括双（2,3-环氧-2-甲基丙基）醚。

公开(公告)号：US06803256B2

公开(公告)日：2004-10-12

申请号：US10039679

申请日：2002-01-04

申请人： Stephen Leslie Buchwalter ,  Hung Manh Dang ,  Michael A. Gaynes ,  Konstantinos I. Papathomas

发明人： Stephen Leslie Buchwalter ,  Hung Manh Dang ,  Michael A. Gaynes ,  Konstantinos I. Papathomas

IPC分类号： H01L2144

CPC分类号： H01L23/3142 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.

摘要翻译： 可与电子组件（例如芯片）结合的电子结构。 电子结构可以通过使用结构环氧树脂粘合剂连接到诸如芯片的电子组件。 电子结构包括金属板上的矿物层和矿物层上的粘附促进剂层。 金属板包括金属物质，其包括具有或不具有金属涂层的纯金属。 金属物质可以包括诸如不锈钢，铝，钛，铜，镀有镍的铜和涂有铬的铜等物质。 矿物层包括衍生自矿物的化合物; 例如来自石英的二氧化硅（SiO 2）。 这样的化合物可以包括二氧化硅，氮化硅和碳化硅等物质。 化合物可以以结晶或无定形形式存在。 粘合促进剂可以包括诸如硅烷，钛酸盐，锆酸盐和铝酸盐的化学物质。

公开(公告)号：US06534179B2

公开(公告)日：2003-03-18

申请号：US09818458

申请日：2001-03-27

申请人： Robert Maynard Japp ,  Konstantinos I. Papathomas ,  Mark D. Poliks

发明人： Robert Maynard Japp ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC分类号： B32B2704

CPC分类号： B32B15/08 ,  B32B27/281 ,  B32B27/38 ,  B32B2457/08 ,  C08G59/304 ,  C08G59/3254 ,  C08L63/00 ,  C08L79/04 ,  C08L79/085 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/2938 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/20

摘要： A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

摘要翻译： 描述了一种无卤介电树脂混合物用于微孔和其它类似应用。 树脂混合物含有氰酸酯单体或预聚物，双马来酰亚胺，环氧树脂和选自次膦酸酐，膦酸和二卤化物和膦酸半酯的阻燃化合物。 阻燃剂的存在量，其中基于树脂混合物的重量，元素磷含量为约2重量％至约20重量％。 树脂混合物还可以包括一种或多种着色剂，荧光剂和UV吸收剂。 还描述了基于与无机或有机增强剂的树脂混合物的预浸料，以及由预浸料制成的电路板和芯片载体。 同样包括用于微孔激光应用的树脂涂层制品。

公开(公告)号：US06524654B1

公开(公告)日：2003-02-25

申请号：US09629533

申请日：2000-07-31

申请人： John Joseph Konrad ,  Konstantinos I. Papathomas ,  John A. Welsh

发明人： John Joseph Konrad ,  Konstantinos I. Papathomas ,  John A. Welsh

IPC分类号： B05D302

CPC分类号： H05K3/282 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K3/28 ,  H05K3/305 ,  Y10S428/901 ,  Y10T428/12889 ,  Y10T428/265 ,  H01L2924/00

摘要： In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent. The present invention also relates to a treatment solution for reducing adhesive resin bleed on the surface of a circuitized organic substrate. The present invention also relates to a circuitized organic substrate that is resistant to resin bleed. Such substrate has a film comprising a fatty acid compound disposed on the circuitized surface thereto.

摘要翻译： 根据本发明，提供了一种处理有机基板的表面，特别是有机基板的电路化表面的方法，该方法减少随后沉积在表面上的粘合剂树脂的扩散。 该方法包括以下步骤：施加包含脂肪酸化合物，碱化剂和包含水的溶剂和约5体积％至约90体积％的选自以下的有机溶剂的处理溶液：醇， 乙二醇醚及其组合; 然后从溶液中基本上除去所有溶剂，以在所述基材的表面上提供薄膜。 该膜包含存在于处理溶液中的脂肪酸。 在优选的实施方案中，处理溶液还包含螯合剂。 本发明还涉及一种用于在电路化的有机基底的表面上减少粘合剂树脂渗出的处理溶液。 本发明还涉及耐树脂流出的电路化有机基材。 这种基材具有包含设置在其电路化表面上的脂肪酸化合物的膜。

公开(公告)号：US06479093B2

公开(公告)日：2002-11-12

申请号：US10062100

申请日：2002-01-31

申请人： John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller ,  Konstantinos I. Papathomas ,  William E. Wilson

发明人： John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller ,  Konstantinos I. Papathomas ,  William E. Wilson

IPC分类号： B05D512

CPC分类号： H05K3/462 ,  H01R4/26 ,  H05K3/0023 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0307 ,  Y10S428/901 ,  Y10T156/1089 ,  Y10T428/24917

摘要： A laminate circuit structure assembly is provided that comprises at least two modularized circuitized plane subassemblies; a joining layer located between each of the subassemblies and wherein the subassemblies and joining layer are bonded together with a cured dielectric from a bondable, curable dielectric. The subassemblies and joining layer are electrically interconnected with bondable electrically conductive material. The joining layer comprises dielectric layers disposed about an internal electrically conductive layer. The electrically conductive layer has a via and the dielectric layers each have a via of smaller diameter than the vias in the electrically conductive layer and are aligned with the vias in the electrically conductive layer. The vias are filled with electrically bondable electrically conductive material for providing electrical contact between the subassemblies.

摘要翻译： 提供了一种层叠电路结构组件，其包括至少两个模块化电路化的平面子组件; 位于每个子组件之间的接合层，并且其中所述子组件和接合层与来自可结合的可固化电介质的固化电介质结合在一起。 子组件和接合层与可结合的导电材料电互连。 接合层包括围绕内部导电层设置的电介质层。 导电层具有通孔，并且介电层各自具有比导电层中的通孔更小的直径的通孔，并且与导电层中的通孔对准。 通孔填充有电可焊接的导电材料，用于在子组件之间提供电接触。

公开(公告)号：US06465084B1

公开(公告)日：2002-10-15

申请号：US09834281

申请日：2001-04-12

申请人： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

发明人： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC分类号： B32B300

CPC分类号： H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

摘要： A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

公开(公告)号：US06429527B1

公开(公告)日：2002-08-06

申请号：US09764047

申请日：2001-01-17

申请人： Donald S. Farquhar ,  Konstantinos I. Papathomas

发明人： Donald S. Farquhar ,  Konstantinos I. Papathomas

IPC分类号： H01L2978

CPC分类号： H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K2203/1461 ,  H01L2924/00

摘要： The present invention provides a method of filling an at least one aperture in a semiconductor substrate by placing a sacrificial carrier structure on a surface of the substrate, wherein the structure comprises, a first layer, a fill material over the first layer, and a mask over fill material having at least one opening therein, such that the opening at least partially aligns with the aperture in the substrate. Thereafter, the fill material is forced into the aperture by the application of heat and pressure, and the sacrificial carrier structure is removed.

摘要翻译： 本发明提供了一种通过在衬底的表面上放置牺牲载体结构来填充半导体衬底中的至少一个孔的方法，其中该结构包括第一层，第一层上的填充材料和掩模 在其中具有至少一个开口的过填充材料，使得该开口至少部分地与衬底中的孔对准。 此后，通过施加热和压力将填充材料压入孔中，并去除牺牲载体结构。

公开(公告)号：US06426470B1

公开(公告)日：2002-07-30

申请号：US09764464

申请日：2001-01-17

申请人： Donald S. Farquhar ,  Robert M. Japp ,  John M. Lauffer ,  Konstantinos I. Papathomas

发明人： Donald S. Farquhar ,  Robert M. Japp ,  John M. Lauffer ,  Konstantinos I. Papathomas

IPC分类号： H05K111

CPC分类号： H05K3/429 ,  H05K2201/0187 ,  H05K2201/096 ,  H05K2201/09645 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

摘要翻译： 涉及多段电镀通孔的方法和结构。 基板包括夹在第一层叠层和第二层叠层之间的电介质层。 穿过基板形成通孔。 通孔穿过介电层内的不可电介质材料。 结果，随后的通孔的接种和电镀导致在第一层压层的段上的通孔的壁上和第二层压层的段上形成导电金属电镀，而不在不可电绝缘的电介质 电介质层的材料。 因此，导电金属电镀从第一层叠层到第二层叠层不是连续的。

公开(公告)号：US06252307B1

公开(公告)日：2001-06-26

申请号：US09537959

申请日：2000-03-28

申请人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

发明人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

IPC分类号： H01L2100

CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/4864 ,  H01L23/49894 ,  H01L24/80 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14

摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.

摘要翻译： 提供了一种方法和结构，用于当将I / C芯片附着到基板上时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属线接合焊盘上的润湿或渗出。 该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。 化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。 这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。 与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。 烃段在贵金属上呈现具有低分子表面张力的分子的特征的表面，并且因此防止了环氧粘合剂组分对贵金属的润湿。一旦它们提供 防止裸片的泄漏附着粘合剂，在引线接合或焊接温度期间自身解吸。