发明申请
- 专利标题： SUBSTRATE SUPPORT INSTRUMENT, AND VERTICAL HEAT TREATMENT APPARATUS AND DRIVING METHOD THEREOF
- 专利标题（中）： 基板支撑仪器及垂直热处理装置及其驱动方法
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申请号： US13441519申请日： 2012-04-06
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公开(公告)号： US20120258414A1公开(公告)日： 2012-10-11
- 发明人: Hiroyuki MATSUURA , Katsuya TOBA
- 申请人： Hiroyuki MATSUURA , Katsuya TOBA
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-86618 20110408; JP2011-186264 20110829; JP2012-26464 20120209
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; F27D5/00 ; F27D3/00 ; H01L21/477
摘要：
A substrate support instrument includes a first support instrument portion and a second support instrument portion detachably combined with each other. Each of the first support instrument portion and second support instrument portion includes: a ceiling plate and a bottom plate facing each other upward and downward; a support pillar disposed in plurality along a peripheral edge portion of each of the ceiling plate and bottom plate, and configured to connect the ceiling plate and the bottom plate; and a support part disposed at a position corresponding to each of the support pillars, and configured to support a bottom of each substrate. In the support part, a height position is set such that a substrate supported in the first support instrument portion and a substrate supported in the second support instrument portion are alternately arranged, when the first support instrument portion is combined with the second support instrument portion.
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