发明申请
- 专利标题: PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 印刷电路板及其制造方法
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申请号: US13189124申请日: 2011-07-22
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公开(公告)号: US20120261166A1公开(公告)日: 2012-10-18
- 发明人: Chang Gun OH , Tae Kyun BAE , Ho Sik PARK
- 申请人: Chang Gun OH , Tae Kyun BAE , Ho Sik PARK
- 申请人地址: KR Gyunggi-do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Gyunggi-do
- 优先权: KR10-2011-0035218 20110415
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; B05D3/00 ; B05D5/12 ; H05K1/11 ; H05K3/46
摘要:
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via.