发明申请
US20120261587A1 Encapsulation of Electrodes in Solid Media for use in conjunction with Fluid High Voltage Isolation
审中-公开
固体介质中的电极封装，与流体高压隔离结合使用
- 专利标题： Encapsulation of Electrodes in Solid Media for use in conjunction with Fluid High Voltage Isolation
- 专利标题（中）： 固体介质中的电极封装，与流体高压隔离结合使用
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申请号： US13437599申请日： 2012-04-02
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公开(公告)号： US20120261587A1公开(公告)日： 2012-10-18
- 发明人: Sean Kellogg , N. William Parker , Mark W. Utlaut , Anthony Graupera
- 申请人： Sean Kellogg , N. William Parker , Mark W. Utlaut , Anthony Graupera
- 申请人地址： US OR Hillsboro
- 专利权人： FEI Company
- 当前专利权人： FEI Company
- 当前专利权人地址： US OR Hillsboro
- 主分类号： G21K5/04
- IPC分类号： G21K5/04
摘要：
An inductively-coupled plasma source for a focused charged particle beam system includes a conductive shield that provides improved electrical isolation and reduced capacitive RF coupling and a dielectric fluid that insulates and cools the plasma chamber. The conductive shield may be enclosed in a solid dielectric media. The dielectric fluid may be circulated by a pump or not circulated by a pump. A heat tube can be used to cool the dielectric fluid.
公开/授权文献
- US08987678B2 Encapsulation of electrodes in solid media 公开/授权日：2015-03-24
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