发明申请
- 专利标题: METAL MICROPARTICLE DISPERSION, PROCESS FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE SUBSTRATE, AND ELECTRICALLY CONDUCTIVE SUBSTRATE
- 专利标题(中): 金属微孔分散体,电导电基板的生产工艺和电导电基板
-
申请号: US13497555申请日: 2010-09-06
-
公开(公告)号: US20120267151A1公开(公告)日: 2012-10-25
- 发明人: Mikiko Hojo , Shinya Yoneda , Naonobu Yoshi , Takeshi Sato , Kisei Matsumoto
- 申请人: Mikiko Hojo , Shinya Yoneda , Naonobu Yoshi , Takeshi Sato , Kisei Matsumoto
- 优先权: JP2009-229073 20090930
- 国际申请: PCT/JP2010/065265 WO 20100906
- 主分类号: H01B1/02
- IPC分类号: H01B1/02 ; H05K3/12 ; H01B1/04 ; H05K1/09
摘要:
Provided are a metal microparticle dispersion which is excellent in a dispersibility, an electrically conductive substrate which is obtained by using the above metal microparticle dispersion and which is excellent in an electrical conductivity and a production process for the same.Provided is a metal microparticle dispersion comprising metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; the above polyester skeleton has at least one of a constitutional unit derived from valerolactone and a constitutional unit derived from caprolactone, and a sum of the numbers of the above constitutional units is 10 or more in terms of an average value, or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, comprising printing a coating solution containing the above metal microparticle dispersion in a pattern-like form to form a printed layer and subjecting the above printed layer to burning treatment to form a pattern-like metal microparticle sintered film, and an electrically conductive substrate produced by the above production process is provided as well.
公开/授权文献
信息查询