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    Conductive substrate comprising a metal fine particle sintered film
    1.
    发明授权
    Conductive substrate comprising a metal fine particle sintered film 有权
    包含金属微粒烧结膜的导电性基材

    公开(公告)号：US09420698B2

    公开(公告)日：2016-08-16

    申请号：US13202425

    申请日：2010-02-19

    申请人： Naonobu Yoshi ,  Mikiko Hojo

    发明人： Naonobu Yoshi ,  Mikiko Hojo

    IPC分类号： H05K1/09 ,  H05K3/12 ,  H05K1/03

    CPC分类号： H05K3/1283 ,  H05K1/0393 ,  H05K2203/1131

    摘要： Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conductivity.The conductive substrate of the present invention is prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section of the metal fine particle sintered film has a void rate of 1% or less.

    摘要翻译： 提供一种导电性基材，其通过在聚酰亚胺等的基材上形成图案形状的金属微粒烧结膜等铜布等而制成，并且与基材具有高的粘接性， 具有优良的导电性。 本发明的导电性基材通过将含有金属或金属氧化物微粒的涂布液印刷在基材上而形成印刷层并对上述印刷层进行烧结处理以形成金属微粒烧结膜来制备，其中， 通过X射线衍射测定的金属微粒烧结膜中的微晶直径为25nm以上，金属微粒烧结膜的截面的空隙率为1％以下。

    METAL MICROPARTICLE DISPERSION, PROCESS FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE SUBSTRATE, AND ELECTRICALLY CONDUCTIVE SUBSTRATE
    2.
    发明申请
    METAL MICROPARTICLE DISPERSION, PROCESS FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE SUBSTRATE, AND ELECTRICALLY CONDUCTIVE SUBSTRATE 有权
    金属微孔分散体，电导电基板的生产工艺和电导电基板

    公开(公告)号：US20120267151A1

    公开(公告)日：2012-10-25

    申请号：US13497555

    申请日：2010-09-06

    申请人： Mikiko Hojo ,  Shinya Yoneda ,  Naonobu Yoshi ,  Takeshi Sato ,  Kisei Matsumoto

    发明人： Mikiko Hojo ,  Shinya Yoneda ,  Naonobu Yoshi ,  Takeshi Sato ,  Kisei Matsumoto

    IPC分类号： H01B1/02 ,  H05K3/12 ,  H01B1/04 ,  H05K1/09

    CPC分类号： B22F1/0022 ,  B22F1/0074 ,  B22F3/1055 ,  B22F2003/1054 ,  B82Y30/00 ,  C23C16/455 ,  H05K1/097 ,  H05K3/125 ,  Y02P10/295

    摘要： Provided are a metal microparticle dispersion which is excellent in a dispersibility, an electrically conductive substrate which is obtained by using the above metal microparticle dispersion and which is excellent in an electrical conductivity and a production process for the same.Provided is a metal microparticle dispersion comprising metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 μm; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; the above polyester skeleton has at least one of a constitutional unit derived from valerolactone and a constitutional unit derived from caprolactone, and a sum of the numbers of the above constitutional units is 10 or more in terms of an average value, or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, comprising printing a coating solution containing the above metal microparticle dispersion in a pattern-like form to form a printed layer and subjecting the above printed layer to burning treatment to form a pattern-like metal microparticle sintered film, and an electrically conductive substrate produced by the above production process is provided as well.

    摘要翻译： 提供一种分散性优异的金属微粒分散体，通过使用上述金属微粒分散体而获得的导电性基体，其导电性优异且其制造方法优异。 提供一种包含金属微粒，聚合物分散剂和分散介质的金属微粒分散体，其中金属微粒的平均一次粒径为0.001〜0.5μm; 聚合物分散剂在其主链和侧链中的至少一个中具有聚酯骨架; 上述聚酯骨架具有来自戊内酯的结构单元和由己内酯衍生的结构单元中的至少一种，上述结构单元的数量之和为平均值以上10以上， 在其主链和侧链中的至少一个中的聚醚骨架; 上述聚合物分散剂的含量相对于100质量份金属微粒的含量为0.1〜100质量份。 此外，提供了一种导电性基材的制造方法，其特征在于，将含有上述金属微粒分散液的涂布溶液印刷成图案状，形成印刷层，对上述印刷层进行燃烧处理，形成图案状 金属微粒烧结膜，以及通过上述制造方法制造的导电性基材。

    CONDUCTIVE SUBSTRATE
    3.
    发明申请
    CONDUCTIVE SUBSTRATE 有权
    导电基片

    公开(公告)号：US20120061130A1

    公开(公告)日：2012-03-15

    申请号：US13202425

    申请日：2010-02-19

    申请人： Naonobu Yoshi ,  Mikiko Hojo

    发明人： Naonobu Yoshi ,  Mikiko Hojo

    IPC分类号： H05K1/09 ,  B05D3/02 ,  H05K3/00

    CPC分类号： H05K3/1283 ,  H05K1/0393 ,  H05K2203/1131

    摘要： Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conductivity.The conductive substrate of the present invention is prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section of the metal fine particle sintered film has a void rate of 1% or less.

    摘要翻译： 提供一种导电性基材，其通过在聚酰亚胺等的基材上形成图案形状的金属微粒烧结膜等铜布等而制成，并且与基材具有高的粘接性， 具有优良的导电性。 本发明的导电性基材通过将含有金属或金属氧化物微粒的涂布液印刷在基材上而形成印刷层并对上述印刷层进行烧结处理以形成金属微粒烧结膜来制备，其中， 通过X射线衍射测定的金属微粒烧结膜中的微晶直径为25nm以上，金属微粒烧结膜的截面的空隙率为1％以下。