发明申请
US20120270400A1 SLURRY FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD FOR SUBSTRATE USING SAME
有权
用于化学机械抛光的浆料和使用其的基材的抛光方法
- 专利标题： SLURRY FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD FOR SUBSTRATE USING SAME
- 专利标题（中）： 用于化学机械抛光的浆料和使用其的基材的抛光方法
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申请号： US13508924申请日： 2010-11-08
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公开(公告)号： US20120270400A1公开(公告)日： 2012-10-25
- 发明人: Minori Takegoshi , Mitsuru Kato , Chihiro Okamoto , Shinya Kato
- 申请人： Minori Takegoshi , Mitsuru Kato , Chihiro Okamoto , Shinya Kato
- 申请人地址： JP Kurashiki-shi, Okayama
- 专利权人： Kuraray Co., Ltd.
- 当前专利权人： Kuraray Co., Ltd.
- 当前专利权人地址： JP Kurashiki-shi, Okayama
- 优先权： JP2009-258444 20091111
- 国际申请： PCT/JP2010/069851 WO 20101108
- 主分类号： H01L21/306
- IPC分类号： H01L21/306 ; C09K13/00
摘要：
The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.
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