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    Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam
    2.
    发明授权
    Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam 有权
    热塑性聚氨酯泡沫，其制造方法和由泡沫制成的抛光垫

    公开(公告)号：US06979701B2

    公开(公告)日：2005-12-27

    申请号：US10432629

    申请日：2001-12-05

    申请人： Shunji Kaneda ,  Chihiro Okamoto

    发明人： Shunji Kaneda ,  Chihiro Okamoto

    IPC分类号： B24B37/24 ,  B24D3/28 ,  B24D13/14 ,  B29C44/34 ,  C08G18/08 ,  C08G18/42 ,  C08G18/66 ,  C08G18/06

    CPC分类号： B24B37/24 ,  B24D3/28 ,  B29C44/348 ,  C08G18/0895 ,  C08G18/4238 ,  C08G18/6607 ,  C08G2101/0066 ,  C08J9/12

    摘要： The present invention aims to provide a polyurethane foam, suitably usable as a polishing pad, having a uniform foam structure, which can achieve the improvements in the flatness of the surface of polished materials and in the planarization efficiency, and can extend the polishing pad life longer than that of the conventional polyurethane foams. This aim can be achieved by providing a polyurethane foam having a density of 0.5 to 1.0 g/cm3, a cell size of 5 to 200 μm and a hardness [JIS-C hardness] of not less than 90, comprising a thermoplastic polyurethane which is obtained by a reaction of a high polymer polyol, an organic diisocyanate and a chain extender, contains not less than 6% by weight of a nitrogen atom derived from the isocyanate group, and has a storage elastic modulus measured at 50° C. [E′50] of not less than 5×109 dyn/cm2.

    摘要翻译： 本发明的目的在于提供一种适合用作抛光垫的聚氨酯泡沫，其具有均匀的泡沫结构，其可以实现抛光材料表面的平整度和平坦化效率的提高，并且可以延长抛光垫寿命 比常规聚氨酯泡沫的长。 该目的可以通过提供密度为0.5〜1.0g / cm 3的聚氨酯泡沫，电池尺寸为5〜200μm，硬度[JIS-C硬度]为不小于 90，其包含通过高分子多元醇，有机二异氰酸酯和扩链剂的反应获得的热塑性聚氨酯，含有不少于6重量％的来自异氰酸酯基团的氮原子，并且具有储能弹性模量 在50℃下测量。[E'50]不小于5×10 9 dyn / cm 2。

    Polyester resin composition
    7.
    发明授权
    Polyester resin composition 失效
    聚酯树脂组合物

    公开(公告)号：US06429243B1

    公开(公告)日：2002-08-06

    申请号：US09719174

    申请日：2000-12-15

    申请人： Chihiro Okamoto ,  Shunro Taniguchi

    发明人： Chihiro Okamoto ,  Shunro Taniguchi

    IPC分类号： C08K324

    CPC分类号： C08L67/02 ,  C08L23/02 ,  C08L53/00 ,  Y10T428/1303 ,  Y10T428/1352 ,  Y10T428/3179 ,  C08L2666/02

    摘要： (A) A polyester resin composition comprising a copolymerized polyethylene terephthalate (copolymerized PET) comprising 5 to 40 mole % of naphthalenedicarboxylic acid units, a cobalt compound and/or a manganese compound, an olefin polymer and a compatibility-improving agent, in specific amounts; and (B) a polyester resin composition comprising the above copolymerized PET which contains specific amounts of both a cobalt compound and a manganese compound are excellent in resistance to hydrogen peroxide, flavor-barrier properties, gas-barrier properties, heatsealability and mechanical properties such as elongation and strength and, utilizing these features, are effectively usable for various end-uses in particular as packaging materials for beverages such as fruit juices containing flavor components.

    摘要翻译： （A）一种聚酯树脂组合物，其特征在于，含有5〜40摩尔％的萘二甲酸单元，钴化合物和/或锰化合物，烯烃聚合物和相容性改善剂的共聚聚对苯二甲酸乙二醇酯（共聚PET） ; 和（B）包含上述含有特定量的钴化合物和锰化合物的共聚PET的聚酯树脂组合物，对过氧化氢的耐受性，香味阻隔性，气体阻隔性，热封性和机械性能如 伸长率和强度，并且利用这些特征可以有效地用于各种最终用途，特别是用作饮料的包装材料，例如含有风味成分的果汁。

    SLURRY FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD FOR SUBSTRATE USING SAME
    8.
    发明申请
    SLURRY FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD FOR SUBSTRATE USING SAME 有权
    用于化学机械抛光的浆料和使用其的基材的抛光方法

    公开(公告)号：US20120270400A1

    公开(公告)日：2012-10-25

    申请号：US13508924

    申请日：2010-11-08

    申请人： Minori Takegoshi ,  Mitsuru Kato ,  Chihiro Okamoto ,  Shinya Kato

    发明人： Minori Takegoshi ,  Mitsuru Kato ,  Chihiro Okamoto ,  Shinya Kato

    IPC分类号： H01L21/306 ,  C09K13/00

    CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/76224

    摘要： The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.

    摘要翻译： 本发明提供了一种用于化学机械抛光的浆料，其包括水溶性包合物（a），具有任选盐形式的酸性基团作为侧链的聚合物化合物（b），研磨磨粒（c）和水（d） 其中，水溶性包合物（a）的含量为浆料总量的0.001质量％-3质量％，高分子化合物（b）的重均分子量为1000以上且小于 1,000份，高分子化合物（b）的含量为浆料总量的0.12质量％-3质量％，使用该浆料的基材的研磨方法。

    Slurry for chemical mechanical polishing and polishing method for substrate using same
    9.
    发明授权
    Slurry for chemical mechanical polishing and polishing method for substrate using same 有权
    用于使用其的基板的化学机械抛光和抛光方法的浆料

    公开(公告)号：US09536752B2

    公开(公告)日：2017-01-03

    申请号：US13508924

    申请日：2010-11-08

    申请人： Minori Takegoshi ,  Mitsuru Kato ,  Chihiro Okamoto ,  Shinya Kato

    发明人： Minori Takegoshi ,  Mitsuru Kato ,  Chihiro Okamoto ,  Shinya Kato

    IPC分类号： C09G1/02 ,  H01L21/306 ,  H01L21/3105 ,  C09K3/14 ,  H01L21/762

    CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/76224

    摘要： The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.

    摘要翻译： 本发明提供了一种用于化学机械抛光的浆料，其包括水溶性包合物（a），具有任选盐形式的酸性基团作为侧链的聚合物化合物（b），研磨磨粒（c）和水（d） 其中，水溶性包合物（a）的含量为浆料总量的0.001质量％-3质量％，高分子化合物（b）的重均分子量为1000以上且小于 1,000份，高分子化合物（b）的含量为浆料总量的0.12质量％-3质量％，使用该浆料的基材的研磨方法。