发明申请
US20120276392A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE
审中-公开
热固性树脂组合物，用于生产树脂组合物变性的方法，PREPREG和层压体
- 专利标题： THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE
- 专利标题（中）： 热固性树脂组合物，用于生产树脂组合物变性的方法，PREPREG和层压体
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申请号： US13518578申请日： 2010-12-24
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公开(公告)号： US20120276392A1公开(公告)日： 2012-11-01
- 发明人: Yoshihiro Takahashi , Yasuo Kamigata , Hikari Murai , Masahiro Aoshima , Shinji Tsuchikawa , Masato Miyatake , Tomohiko Kotake , Hiroyuki Izumi
- 申请人： Yoshihiro Takahashi , Yasuo Kamigata , Hikari Murai , Masahiro Aoshima , Shinji Tsuchikawa , Masato Miyatake , Tomohiko Kotake , Hiroyuki Izumi
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2009-296058 20091225; JP2010-160979 20100715; JP2010-165556 20100723
- 国际申请： PCT/JP2010/073376 WO 20101224
- 主分类号： C08K5/3415
- IPC分类号： C08K5/3415 ; C09D163/00 ; B32B15/092 ; B05D5/00 ; B32B15/08 ; C08L63/00 ; B32B37/14
摘要：
Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.
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