A cleaning assembly is provided. The cleaning assembly includes a plate having a front surface and a back surface and a manifold affixed to an edge of the plate. The manifold has a plurality of outlets extending therefrom. The plate further includes a plurality of cups extending through the plate. The plurality of cups have an upper body with an outlet extending from the back surface and the plurality of cups have a sealing portion coupled to the upper body and extending from the front surface of the plate. Each outlet of the upper body is coupled to one of the corresponding plurality of outlets of the manifold. The plate also includes a plurality of alignment pins extending from the front surface of the plate. The plurality of alignment pins are configured to support an edge of a substrate, wherein one of the plurality of alignment pins is slidably mounted to the plate. A plurality of guide pins extends the same distance from the back surface.