发明申请
- 专利标题： THERMAL CONDUCTIVE SHEET, INSULATING SHEET, AND HEAT DISSIPATING MEMBER
- 专利标题（中）： 导热片，绝缘片和散热片
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申请号： US13469982申请日： 2012-05-11
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公开(公告)号： US20120286194A1公开(公告)日： 2012-11-15
- 发明人: Keisuke HIRANO
- 申请人： Keisuke HIRANO
- 申请人地址： JP Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2011-108584 20110513
- 主分类号： C09K5/14
- IPC分类号： C09K5/14
摘要：
A thermal conductive sheet contains a resin and a filler. The filler contains a plate-like or flake-like first filler and a block-like or sphere-like second filler, and the average orientation angle of the first filler is 28 degrees or more and the maximum orientation angle thereof is 60 degrees or more with respect to the plane direction of the thermal conductive sheet.
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