发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 半导体器件及其制造方法
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申请号: US13466583申请日: 2012-05-08
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公开(公告)号: US20120286261A1公开(公告)日: 2012-11-15
- 发明人: Shinya SASAGAWA , Akihiro ISHIZUKA , Takehisa HATANO
- 申请人: Shinya SASAGAWA , Akihiro ISHIZUKA , Takehisa HATANO
- 申请人地址: JP Atsugi-shi
- 专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2011-108052 20110513
- 主分类号: H01L29/12
- IPC分类号: H01L29/12 ; H01L21/336
摘要:
In a transistor including a wide band gap semiconductor layer as a semiconductor layer, a wide band gap semiconductor layer is separated into an island shape by an insulating layer with passivation properties for preventing atmospheric components from permeating. The edge portion of the island shape wide band gap semiconductor layer is in contact with the insulating film; thus, moisture or atmospheric components can be prevented from entering from the edge portion of the semiconductor layer to the wide band gap semiconductor layer.
公开/授权文献
- US09105749B2 Semiconductor device and manufacturing method thereof 公开/授权日:2015-08-11
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